Heat dissipation in electronics with a heat spreader
Heat dissipation configurations and methods are described herein. Certain electronic devices may include an individual piece of thermally conductive material having a first surface and a second surface. A first section of the thermally conductive material may be positioned between a motherboard and a backing layer of an electronic device such that the first surface of the first section is adjacent to the motherboard and the second surface of the first section is adjacent to the backing layer. A second section of the thermally conductive material may be positioned between a display module and a battery of the electronic device such that the first surface of the second section is adjacent to a back plate of the display module and the second surface of the second section is adjacent to the battery. The thermally conductive material may be configured to transfer heat between the first section and the second section.
1. A device comprising:
a motherboard;
a backing layer;
a battery;
a display module; and
an individual piece of thermally conductive material comprising a first surface and a second surface,
wherein a first section of the thermally conductive material is positioned between the motherboard and the backing layer such that the first surface of the first section is adjacent to the motherboard and the second surface of the first section is adjacent to the backing layer,
wherein a second section of the thermally conductive material is positioned between the display module and the battery of the electronic device such that the first surface of the second section is adjacent to a back plate of the display module and the second surface of the second section is adjacent to the battery,
wherein the first section of the thermally conductive material lies in a first plane and the second section of the thermally conductive material lies in a second plane, separate from and parallel with the first plane, and
wherein the first section and the second section are joined by a connecting section of the thermally conductive material.
2. The device of claim 1 , wherein the thermally conductive material comprises graphite.
3. The device of claim 1 , wherein the connecting section of the thermally conductive material lies in a third plane, and
wherein an angle of inclination from the first plane to the third plane is 10 degrees or less.
4. The device of claim 1 , wherein the thermally conductive material is configured to transfer heat generated from the motherboard to the back plate of the display module.
5. A device comprising:
a display module having a conductive back plate;
a backing layer;
a motherboard positioned between the back plate of the display module and the backing layer;
a battery positioned between the back plate of the display module and the backing layer;
a heat spreader comprising a first surface and a second surface, wherein a first section of the heat spreader is positioned between the motherboard and the backing layer such that the first surface of the first section is adjacent to the motherboard and the second surface of the first section is contacting the backing layer, and wherein a second section of the heat spreader is positioned between the back plate of the display module and the battery such that the first surface of the second section is contacting the back plate and the second surface of the second section is adjacent to the battery; and
a compressible layer positioned between the second surface of the second section of the heat spreader and the battery, wherein the compressible layer comprises an opening in a center of the compressible layer, wherein the opening is configured to provide an area for the battery to expand in a direction of the back plate.
6. The device of claim 5 , wherein the heat spreader is an individual piece of thermally conductive material.
7. The device of claim 6 , wherein the thermally conductive material comprises graphite.
8. The device of claim 5 , wherein the first section of the heat spreader lies in a first plane and the second section of the heat spreader lies in a second plane, separate from and parallel with the first plane, and
wherein the first section and the second section are joined by a connecting section of the heat spreader.
9. The device of claim 8 , wherein the connecting section of the heat spreader lies in a third plane, and
wherein an angle of inclination from the first plane to the third plane is 10 degrees or less.
10. The device of claim 5 , wherein the heat spreader is configured to transfer heat generated from the motherboard to the back plate of the display module.
11. The device of claim 5 , further comprising:
a first adhesive layer positioned between the second surface of the second section of the heat spreader and the compressible layer; and
a second adhesive layer positioned between the compressible layer and the battery.
12. The device of claim 5 , further comprising:
a vapor chamber, heat sink, heat fin, or heat pipe positioned between the motherboard and the first surface of the first section of the heat spreader.
13. The device of claim 5 , wherein the conductive back plate of the display module comprises aluminum or stainless steel.
14. A device comprising:
a backing layer;
a display module; and
an individual piece of thermally conductive material comprising a first surface and a second surface,
wherein a first section of the thermally conductive material is positioned adjacent to the backing layer,
wherein a second section of the thermally conductive material is positioned adjacent to a back plate of the display module,
wherein the first section of the thermally conductive material lies in a first plane and the second section of the thermally conductive material lies in a second plane, separate from and parallel with the first plane, and
wherein the first section and the second section are joined by a connecting section of the thermally conductive material.
15. The device of claim 14 , wherein the connecting section of the thermally conductive material lies in a third plane, and
wherein the angle of inclination from the first plane to the third plane is 10 degrees or less.
16. The device of claim 15 , wherein the thermally conductive material is configured to transfer heat generated from a heat source positioned adjacent to the first section of the thermally conductive material to the back plate of the display module.
17. The device of claim 16 , wherein the thermally conductive material comprises graphite.
18. The device of claim 14 , wherein the thermally conductive material is configured to transfer heat generated from a heat source positioned adjacent to the first section of the thermally conductive material to the back plate of the display module.
19. The device of claim 18 , wherein the thermally conductive material comprises graphite.
20. The device of claim 14 , wherein the thermally conductive material comprises graphite.