IP Library Granted Patent US 9,746,499
Granted Patent B2
US 9,746,499 · App. 14/697,752 · Granted Aug 29, 2017

Hybrid current sensor assembly

Inventors: Hong Il Chae (Gyungsangbuk-do, KR); You Sik Choi (Gyungsangbuk-do, KR); Shin Wook Kang (Gyungsangbuk-do, KR); Young Woon Kim (Gyungsangbuk-do, KR)
Assignee: Tyco Electronics AMP Korea Ltd
G01R15/202G01R1/203G01R15/08G01R15/142G01R15/146G01R15/207
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Quick Facts
Patent No.
US 9,746,499
App. No.
14/697,752
Granted
Aug 29, 2017
Kind
B2
Abstract

A hybrid current sensor assembly has a conductor, Hall core, Hall sensor, shunt terminal, and a microprocessor. The conductor has a first terminating end and a second terminating end. The Hall core generates a magnetic field from current flow in the conductor. The Hall sensor measures potential difference between first terminating end and the second terminating end of the conductor based on the magnetic field applied to the Hall core. The shunt terminal is positioned on a central portion of the conductor. The microprocessor is connected to the shunt terminal to measure the current flow in the conductor.

Claims (22)

1. A hybrid current sensor assembly, comprising:

a conductor having a first terminating end and a second terminating end;

a Hall core that generates a magnetic field from current flow in the conductor;

a Hall sensor that measures potential difference between the first terminating end and the second terminating end of the conductor based on the magnetic field applied to the Hall core;

a shunt terminal positioned on a central portion of the conductor;

a microprocessor connected to the shunt terminal to measure the current flow in the conductor; and

a circuit board to which the Hall sensor, the microprocessor, and the shunt terminal are connected, the circuit board having a core receiving passageway into which the Hall core is positioned.

2. The hybrid current sensor assembly of claim 1 , further comprising:

a housing having a component receiving space therein to receive the Hall core, the Hall sensor, the shunt terminal, the microprocessor, and the central portion of the conductor.

3. The hybrid current sensor assembly of claim 2 , wherein the first terminating end and the second terminating end of the conductor are externally exposed from the housing, extending outward from opposite sides of the housing.

4. The hybrid current sensor assembly of claim 1 , wherein the Hall core is positioned to focus the generated magnetic field on the Hall sensor.

5. The hybrid current sensor assembly of claim 4 , wherein the Hall core comprises:

a first face to cover a bottom side of the conductor;

a second face bent outward from an edge of the first face; and

a third face bent outward correspondingly from an opposite edge of the first face so that the second and third faces cover two opposite sides of the conductor.

6. The hybrid current sensor assembly of claim 5 , wherein the core receiving passageway is a slot formed in the circuit board, and at least one of the second face and the third face is positioned in the core receiving passageway to extend through the circuit board.

7. The hybrid current sensor assembly of claim 5 , wherein the Hall core has

a first end portion bent from an end of the second face towards the third face; and

a second end portion bent correspondingly from the third face towards the second face so that the first end portion and the second end portion extend towards each other.

8. The hybrid current sensor assembly of claim 7 , wherein the core receiving passageway is a groove linearly recessed in an inward direction from an edge of the circuit board, and at least one of the second face and the third face is slidingly connected to the circuit board through the core receiving passageway.

9. The hybrid current sensor assembly of claim 7 , wherein the Hall core is positioned to cover the conductor and the circuit board.

10. The hybrid current sensor assembly of claim 7 , wherein the Hall sensor is positioned in a gap between the first end portion and the second end portion of the Hall core.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 28, 2015
From: CHAE, HONG IL; CHOI, YOU SIK; KANG, SHIN WOOK; KIM, YOUNG WOON
To: TYCO ELECTRONICS AMP KOREA LTD
Reel/Frame 035510/0769 →
Priority Claims (2)
KR 10-2014-0050656 · Apr 28, 2014 · national
KR 10-2014-0124358 · Sep 18, 2014 · national
Continuity (1)
Related Publication 20150309080A1 · Oct 29, 2015