Conformal low temperature hermetic dielectric diffusion barriers
Conformal hermetic dielectric films suitable as dielectric diffusion barriers over 3D topography. In embodiments, the dielectric diffusion barrier includes a dielectric layer, such as a metal oxide, which can be deposited by atomic layer deposition (ALD) techniques with a conformality and density greater than can be achieved in a conventional silicon dioxide-based film deposited by a PECVD process for a thinner contiguous hermetic diffusion barrier. In further embodiments, the diffusion barrier is a multi-layered film including a high-k dielectric layer and a low-k or intermediate-k dielectric layer (e.g., a bi-layer) to reduce the dielectric constant of the diffusion barrier. In other embodiments a silicate of a high-k dielectric layer (e.g., a metal silicate) is formed to lower the k-value of the diffusion barrier by adjusting the silicon content of the silicate while maintaining high film conformality and density.
1. A method of fabricating a microelectronic device, the method comprising:
forming a pair of adjacent metal interconnect lines over a substrate, the pair of interconnect lines separated by a space;
forming an air gap within a low-k interlayer dielectric (ILD) material disposed in the space between the metal interconnect lines; and
forming a contiguous dielectric diffusion barrier that is a multilayer film stack spanning the space, the multilayer film stack comprising a first material layer on a second material layer between the air gap and a portion of the low-k ILD material on a sidewall of at least one of the metal interconnect lines, wherein at least one of the first material layer and the second material layer comprises a metal species and oxygen, and wherein forming the diffusion barrier comprises depositing the at least one of the first material layer and the second material layer using an atomic layer deposition (ALD) process.
2. The method claim 1 , wherein depositing the at least one of the first material layer and the second material comprises depositing a layer of high-k dielectric material having a dielectric constant between 8 and 10.
3. The method of claim 2 , wherein the layer of high-k dielectric material consists essentially of one of: Al 2 O 3 , MgO 2 , and HfO 2 .
4. The method of claim 1 , further comprising passivating an exposed surface of the pair of metal interconnect lines by performing a PECVD deposition of a SiCN:H, SiC:H, or SiOC:H film prior to performing the ALD process.
5. The method of claim 2 , wherein forming the dielectric diffusion barrier further comprises alloying the high-k dielectric material with silicon to form a metal silicate having a dielectric constant below 7.
6. The method of claim 5 , wherein alloying the high-k dielectric material with silicon further comprises cyclically depositing, with an ALD process, Al 2 O 3 layers and SiO 2 layers to form aluminosilicate (Al y Si 1-y O x ) or MgO 2 layer and SiO 2 layers to form magnesiosilicate (Mg y Si 1-y O x ).
7. The method of claim 1 , wherein forming the dielectric diffusion barrier further comprises depositing by PECVD a layer of intermediate-k dielectric material having a dielectric constant below that of the high-k dielectric material and above that of the low-k dielectric material.
8. The method of claim 7 , wherein the dielectric diffusion barrier is deposited to a thickness less than 10 nm and wherein the intermediate-k dielectric material comprises carbon-doped silicon oxynitride.
9. The method of claim 1 , wherein forming the contiguous dielectric diffusion barrier spanning the space, further comprises:
etching a trench in a first layer of the low-k ILD disposed between the pair of metal interconnect lines; and
lining the trench with the dielectric diffusion barrier, and
wherein forming the air gap further comprises depositing a second ILD layer with a non-conformal process.
10. The method of claim 1 , further comprising
etching an opening through a region of the dielectric diffusion barrier disposed over one of the interconnect metal lines, and
forming a second level metal interconnect via through the opening.