Inductor with conductive trace
Among other things, an inductor comprising a conductive trace and a method for forming the inductor are provided. The inductor comprises a magnetic structure, such as a ferrite core. A molding material, such as a dielectric, is formed around the magnetic structure. A conductive trace, comprising one or more conductive pillars interconnected by one or more upper interconnects and one or more lower interconnects, is formed around the magnetic structure to form the inductor. The conductive trace allows physical limitations associated with winding a wire to be avoided, and thus allows the inductor to be smaller than wire wound inductors. In one example, the inductor is formed within an integrated circuit package comprising an active device, such as an integrated circuit. In this way, the inductor can be connected to the integrated circuit within the integrated circuit package.
1. An integrated circuit package comprising:
a molding material;
an inductor comprising:
a magnetic structure embedded within the molding material; and
a conductive trace formed around the magnetic structure, the conductive trace comprising:
one or more conductive pillars formed within and in direct contact with the molding material;
one or more upper interconnects formed within an upper redistribution layer formed above the molding material and having a planar top surface, a first upper interconnect of the one or more upper interconnects positioned above the magnetic structure and connecting a first conductive pillar of the one or more conductive pillars and a second conductive pillar of the one or more conductive pillars; and
one or more lower interconnects formed within a lower redistribution layer formed below the molding material, a first lower interconnect of the one or more lower interconnects positioned below the magnetic structure and connecting the first conductive pillar and a third conductive pillar of the one or more conductive pillars; and
an active device embedded within the molding material and electrically coupled to the inductor, the active device laterally disposed and co-planar with the magnetic structure.
2. The integrated circuit package of claim 1 , the molding material comprising a dielectric.
3. The integrated circuit package of claim 1 , the magnetic structure configured as at least one of a closed loop structure, an open core structure, or a rod structure.
4. The integrated circuit package of claim 1 , the conductive trace comprising copper.
5. The integrated circuit package of claim 1 , comprising:
a first connector configured to connect the inductor to the active device; and
a second connector configured to connect the inductor to the active device.
6. The integrated circuit package of claim 1 , the active device comprising a power management integrated circuit, and the inductor configured to at least one of step up voltage or step down voltage to the power management integrated circuit.
7. The integrated circuit package of claim 1 , comprising:
a first ball mount connected to the conductive trace at a first position; and
a second ball mount connected to the conductive trace at a second position.
8. The integrated circuit package of claim 1 , at least some of the one or more conductive pillars having a diameter of about 0.1 microns to about 20 microns.
9. The integrated circuit package of claim 1 , the inductor formed according to a fan-out wafer structure.
10. The integrated circuit package of claim 1 , the integrated circuit package having a height of about 0.1 millimeters to about 1 millimeter.
11. An integrated circuit package, comprising:
a molding material;
an inductor comprising:
a magnetic structure;
one or more conductive pillars formed around the magnetic structure and in direct contact with the molding material;
an upper redistribution structure formed on top of the molding material and the magnetic structure and having a planar top surface, the upper redistribution structure comprising an upper interconnect connecting a first conductive pillar of the one or more conductive pillars to a second conductive pillar of the one or more conductive pillars, the second conductive pillar positioned on a diametrically opposite side of the magnetic structure relative to the first conductive pillar; and
a lower redistribution structure formed on a bottom of the molding material and the magnetic structure, the lower redistribution structure comprising a lower interconnect connecting the first conductive pillar to a third conductive pillar of the one or more conductive pillars, the third conductive pillar positioned on the diametrically opposite side of the magnetic structure relative to the first conductive pillar; and
an active device laterally disposed and co-planar with the magnetic structure.
12. The integrated circuit package of claim 11 , a height of the molding material substantially equal to a height of the magnetic structure.
13. The integrated circuit package of claim 11 , the upper redistribution structure comprising a dielectric material into which the upper interconnect is formed.
14. The integrated circuit package of claim 11 , the active device embedded within the molding material.
15. The integrated circuit package of claim 11 , at least some of the one or more conductive pillars having a diameter of about 0.1 microns to about 20 microns.