IP Library Granted Patent US 9,761,627
Granted Patent B2
US 9,761,627 · App. 15/143,909 · Granted Sep 12, 2017

Image sensor and electronic device including the same

Inventors: Yong Wan Jin (Seoul, KR); Kyu Sik Kim (Yongin-si, KR); Kyung Bae Park (Hwaseong-si, KR); Kwang Hee Lee (Yongin-si, KR); Dong-Seok Leem (Hwaseong-si, KR); Deukseok Chung (Yongin-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H01L27/14645H01L27/14621H01L27/14625H01L27/14627H01L27/14629H01L27/14636
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,761,627
App. No.
15/143,909
Granted
Sep 12, 2017
Kind
B2
Abstract

An image sensor includes a semiconductor substrate integrated with at least one first photo-sensing device configured to sense light in a blue wavelength region and at least one second photo-sensing device configured to sense light in a red wavelength region, a color filter layer on the semiconductor substrate and including a blue color filter configured to selectively absorb light in a blue wavelength region and a red color filter configured to selectively absorb light in a red wavelength region, and a third photo-sensing device on the color filter layer and including a pair of electrodes facing each other, and a photoactive layer between the pair of electrodes and configured to selectively absorb light in a green wavelength region.

Claims (28)

1. An image sensor, comprising:

a semiconductor substrate integrated with at least one first photo-sensing device configured to sense light in a blue wavelength region, and at least one second photo-sensing device configured to sense light in a red wavelength region, and a metal wire beneath the at least one first photo-sensing device and the at least one second photo-sensing device;

a color filter layer on the semiconductor substrate, the color filter layer including a blue color filter configured to selectively absorb light in a blue wavelength region and a red color filter configured to selectively absorb light in a red wavelength region; and

a third photo-sensing device on the color filter layer, the third photo-sensing device including,

a pair of electrodes facing each other, and

a photoactive layer between the pair of electrodes, the photoactive layer configured to selectively absorb light in a green wavelength region.

2. The image sensor of claim 1 , wherein

the blue wavelength region has a maximum absorption wavelength (λ max ) in a region of greater than or equal to about 400 nm and less than about 500 nm,

the red wavelength region has a maximum absorption wavelength (λ max ) in a region of greater than about 580 nm and less than or equal to about 700 nm, and

the green wavelength region has a maximum absorption wavelength (λ max ) in a region of about 500 nm to about 580 nm.

3. The image sensor of claim 1 , wherein

the pair of electrodes are light-transmitting electrodes, and

the photoactive layer includes a p-type semiconductor material and an n-type semiconductor material, at least one of the p-type semiconductor material and the n-type semiconductor material configured to selectively absorb light in the green wavelength region.

4. The image sensor of claim 1 , further comprising:

a focusing lens on the third photo-sensing device.

5. An electronic device comprising the image sensor of claim 1 .

6. The image sensor of claim 1 , wherein the semiconductor substrate further comprises a charge storage device.

7. The image sensor of claim 1 , wherein the metal wire includes one of aluminum (Al), copper (Cu), silver (Ag), and alloys thereof.

8. The image sensor of claim 1 , further comprising:

a lower insulation layer on the semiconductor substrate; and

an upper insulation layer on the lower insulation layer.

9. The image sensor of claim 3 , wherein the p-type semiconductor material and the n-type semiconductor material form a pn junction.

10. The image sensor of claim 3 , wherein

the light-transmitting electrodes include one of a transparent conductor layer, a metal layer and a metal layer doped with a metal oxide,

the p-type semiconductor material includes one of quinacridone and a derivative thereof, and

the n-type semiconductor material includes a cyanovinyl group-containing thiophene derivative.

11. The electronic device of claim 5 , wherein the electronic device is one of a mobile phone and a digital camera.

12. The image sensor of claim 8 , wherein the lower insulation layer includes one of silicon oxide, silicon nitride, SiC, SiCOH, SiCO, SiOF, and combinations thereof.

Priority Claims (2)
KR 10-2014-0005310 · Jan 15, 2014 · national
KR 10-2014-0098567 · Jul 31, 2014 · national
Continuity (2)
Continuation 14560920 · Dec 4, 2014
Related Publication 20160247852A1 · Aug 25, 2016