Manufacturing method of semiconductor device
It is an object to provide a manufacturing method of a structure of a thin film transistor including an oxide semiconductor film, in which threshold voltage at which a channel is formed is positive and as close to 0 V as possible. A protective insulating layer is formed to cover a thin film transistor including an oxide semiconductor layer that is dehydrated or dehydrogenated by first heat treatment, and second heat treatment at a temperature that is lower than that of the first heat treatment, in which the increase and decrease in temperature are repeated plural times, is performed, whereby a thin film transistor including an oxide semiconductor layer, in which threshold voltage at which a channel is formed is positive and as close to 0 V as possible without depending on the channel length, can be manufactured.
1. A manufacturing method of a semiconductor device comprising the steps of:
forming a first electrode layer over a substrate having an insulating surface;
forming a first insulating layer over the first electrode layer;
forming an oxide semiconductor layer over the first insulating layer;
dehydrating or dehydrogenating the oxide semiconductor layer;
forming a second electrode layer and a third electrode layer over the oxide semiconductor layer;
forming a second insulating layer over the oxide semiconductor layer;
forming a third insulating layer over the second insulating layer;
forming a fourth insulating layer over the third insulating layer;
forming a fourth electrode layer over the second insulating layer; and
performing a heat treatment after forming the second insulating layer,
wherein the second insulating layer contains silicon, oxygen and nitrogen,
wherein the third insulating layer contains aluminum and oxygen,
wherein the fourth insulating layer contains silicon and nitrogen,
wherein a treatment temperature of the heat treatment is lower than a treatment temperature of the dehydrating or the dehydrogenating,
wherein the dehydrating or the dehydrogenating is performed in a nitrogen atmosphere, and
wherein the heat treatment is performed in an oxygen atmosphere.
2. The manufacturing method of a semiconductor device according to claim 1 ,
wherein the heat treatment is performed after forming the fourth insulating layer.
3. The manufacturing method of a semiconductor device according to claim 1 ,
wherein a temperature of the dehydrating or the dehydrogenating is higher than or equal to 350° C. and lower than or equal to 750° C.
4. The manufacturing method of a semiconductor device according to claim 1 ,
wherein a temperature of the heat treatment is higher than or equal to 100° C. and lower than or equal to 300° C.
5. The manufacturing method of a semiconductor device according to claim 1 ,
wherein the second insulating layer is a protective insulating layer.
6. A manufacturing method of a semiconductor device comprising the steps of:
forming a first gate electrode layer over a substrate having an insulating surface;
forming a first insulating layer over the first gate electrode layer;
forming an oxide semiconductor layer over the first insulating layer;
dehydrating or dehydrogenating the oxide semiconductor layer;
forming a source electrode layer and a drain electrode layer over the oxide semiconductor layer;
forming a second insulating layer over the oxide semiconductor layer;
forming a third insulating layer over the second insulating layer;
forming a fourth insulating layer over the third insulating layer;
forming a second gate electrode layer over the second insulating layer; and
performing a heat treatment, after forming the second insulating layer,
wherein the second insulating layer contains silicon, oxygen and nitrogen,
wherein the third insulating layer contains aluminum and oxygen,
wherein the fourth insulating layer contains silicon and nitrogen, and
wherein a thickness of the oxide semiconductor layer is greater than or equal to 5 nm and less than or equal to 200 nm,
wherein a treatment temperature of the heat treatment is lower than a treatment temperature of the dehydrating or the dehydrogenating,
wherein the dehydrating or the dehydrogenating is performed in a nitrogen atmosphere, and
wherein the heat treatment is performed in an oxygen atmosphere.
7. The manufacturing method of a semiconductor device according to claim 6 ,
wherein the heat treatment is performed after forming the fourth insulating layer.
8. The manufacturing method of a semiconductor device according to claim 6 ,
wherein a temperature of the step of dehydrating or dehydrogenating the oxide semiconductor layer is higher than or equal to 350° C. and lower than or equal to 750° C.
9. The manufacturing method of a semiconductor device according to claim 6 ,
wherein a temperature of the heat treatment is higher than or equal to 100° C. and lower than or equal to 300° C.
10. The manufacturing method of a semiconductor device according to claim 6 ,
wherein the second insulating layer is a protective insulating layer.
11. A manufacturing method of a semiconductor device comprising the steps of:
forming a first gate electrode layer over a substrate having an insulating surface;
forming a first insulating layer over the first gate electrode layer;
forming an oxide semiconductor layer over the first insulating layer;
dehydrating or dehydrogenating the oxide semiconductor layer;
forming a source electrode layer and a drain electrode layer over the oxide semiconductor layer;
forming a second insulating layer over the oxide semiconductor layer;
forming a third insulating layer over the second insulating layer;
forming a fourth insulating layer over the third insulating layer;
forming a second gate electrode layer over the second insulating layer; and
performing a heat treatment, after forming the second insulating layer,
wherein the second insulating layer contains silicon, oxygen and nitrogen,
wherein the third insulating layer contains aluminum and oxygen,
wherein the fourth insulating layer contains silicon and nitrogen,
wherein a thickness of the oxide semiconductor layer is greater than or equal to 5 nm and less than or equal to 200 nm,
wherein a treatment temperature of the heat treatment is lower than a treatment temperature of the dehydrating or the dehydrogenating,
wherein the oxide semiconductor layer contains indium, gallium and zinc,
wherein the first insulating layer is a stacked-layer structure of a first layer containing silicon and nitrogen and a second layer containing silicon and oxygen,
wherein the dehydrating or the dehydrogenating is performed in a nitrogen atmosphere, and
wherein the heat treatment is performed in an oxygen atmosphere.
12. The manufacturing method of a semiconductor device according to claim 11 ,
wherein the heat treatment is performed after forming the fourth insulating layer.
13. The manufacturing method of a semiconductor device according to claim 11 ,
wherein a temperature of the dehydrating or the dehydrogenating the oxide semiconductor layer is higher than or equal to 350° C. and lower than or equal to 750° C.
14. The manufacturing method of a semiconductor device according to claim 11 ,
wherein a temperature of the heat treatment is higher than or equal to 100° C. and lower than or equal to 300° C.
15. The manufacturing method of a semiconductor device according to claim 11 ,
wherein the second insulating layer is a protective insulating layer.