Powered removal for element formed by electron beam melting
A method for forming a part. The method includes: forming a first portion of the part at a first level; forming a second portion of the part at a second level; wherein forming the first and second portions includes exposing the first and second levels to a sintering process and portions of the first and second levels to an electron beam; forming a wire in the passage formed inside the first and second portions by exposing a portion of the passage to the electron beam; applying a signal to the wire to break up sintered material in the passage; and removing the wire.
1. A method for forming a part, the method comprising:
forming a first portion of the part at a first level;
forming a second portion of the part at a second level;
wherein forming the first and second portions includes exposing the first and second levels to a sintering process and portions of the first and second levels to an electron beam;
forming a wire in the passage formed inside the first and second portions by exposing a portion of the passage to the electron beam;
applying a signal to the wire to break up sintered material in the passage; and
removing the wire.
2. The method of claim 1 , wherein the first and second levels are formed from a sintered metallic powder.
3. The method of claim 2 , wherein forming the at least one wire includes forming a first wire and a second wire.
4. The method of claim 2 , wherein the first wire has a sinusoidal shape.
5. The method of claim 2 , wherein forming the at least one wire includes forming a cleaning element on the wire.
6. The method of claim 5 , wherein the cleaning element has a larger cross-section than the wire.
7. The method of claim 6 , further, comprising:
forming a secondary wire;
forming a secondary cleaning element on the second wire;
applying a signal to the secondary wire; and
removing the secondary wire and the secondary cleaning element.
8. The method of claim 7 , wherein the wire passes at least partially through the secondary cleaning element.
9. The method of claim 1 , wherein the signal is an ultrasonic signal.
10. A method for forming a part, the method comprising:
forming a first portion of the part at a first level;
forming a second portion of the part at a second level;
wherein the first and second portions are formed by exposing, respectively, by exposing some of the first level and some of the second level to a laser beam;
forming a wire in the passage formed inside the first and second portions by exposing a portion of the passage to the laser beam;
applying a signal to the wire to break up sintered material in the passage; and
removing the wire.
11. The method of claim 10 , wherein the first and second levels are formed from a powder.
12. The method of claim 11 , wherein forming the at least one wire includes forming a first wire and a second wire.
13. The method of claim 11 , wherein the first wire has a sinusoidal shape.
14. The method of claim 11 , wherein forming the at least one wire includes forming a cleaning element on the wire.
15. The method of claim 14 , wherein the cleaning element has a larger cross-section than the wire.
16. The method of claim 15 , further, comprising:
forming a secondary wire;
forming a secondary cleaning element on the second wire;
applying a signal to the secondary wire; and
removing the secondary wire and the secondary cleaning element.
17. The method of claim 16 , wherein the wire passes at least partially through the secondary cleaning element.
18. The method of claim 10 , wherein the signal is an ultrasonic signal.