Thermal and photo-initiation curing system of photopolymer resin for 3D printing
View Patent ↗Photopolymer resin formulation for 3D printing enhancing the performance of 3D printed objects. In one example, additives comprising two photoinitiators with different absorption spectrums are used to achieve printing and post-curing processes. A thermal initiator can also be used to complete the post-curing process by baking at appropriate temperature. Additive combinations balanced to absorb some light in the near UV range of about 400 nm to about 420 nm absorption wavelength band or spectrum while fluorescing light at frequencies higher than their absorption wavelength allowing the creation of clear transparent materials using only near UV light sources (i.e., about 400 nm to about 420 nm) instead of deep UV (<400 nm) light sources.
1. A 3D printing resin formulation comprising: about 0.98% by weight of a photoinitiator in the form of acyl phosphine oxide; about 0.98% by weight of a thermal initiator in the form of benzoyl peroxide; about 68.50% by weight of an oligomer in the form of a low viscosity aliphatic urethane diacrylate; about 24.49% by weight of a monomer in the form of dipropylene glycol diacrylate; and about 0.10% weight of a light blocker and optical brightener in the form of 2,2′-(2,5-thiophenediyl)bis(5-tert-butylbenzoxazole).
2. The 3D printing resin formulation of claim 1 further comprising about 4.95% by weight of a second monomer in the form of a low odor monofunctional acrylated aliphatic epoxy.
3. A 3D printing resin formulation comprising about 0.98% by weight of a photoinitiator in the form of acyl phosphine oxide; about 68.50% by weight of an oligomer in the form of a low viscosity aliphatic urethane diacrylate; about 24.49% by weight of a monomer in the form of dipropylene glycol diacrylate; about 0.10% by weight of a light blocker and optical brightener in the form of 2,2′-(2,5-thiophenediyl)bis(5-tert-butylbenzoxazole); and a thermal initiator having an initiation temperature range higher than a temperature reached during a 3D printing process and lower than a maximum temperature that a printed 3D object can maintain its structure after a post 3D printing baking process.