Elastic wave device and method for manufacturing the same

1. An elastic wave device comprising:

a supporting substrate;

an acoustic reflection layer on the supporting substrate;

a piezoelectric layer on the acoustic reflection layer; and

an IDT electrode on an upper or lower surface of the piezoelectric layer, the piezoelectric layer being thinner than a period of fingers of the IDT electrode; wherein

the acoustic reflection layer includes a low-acoustic-impedance layer and a high-acoustic-impedance layer having a higher acoustic impedance than an acoustic impedance of the low-acoustic-impedance layer;

the low-acoustic-impedance layer is made of SiO 2 , and the high-acoustic-impedance layer is made of at least one material selected from the group consisting of W, LiTaO 3 , AI 2 O 3 , AIN, LiNbO 3 , SiN, and ZnO;

the piezoelectric layer is made of LiNbO 3 or LiTaO 3 ;

Euler Angles of the LiNbO 3 of the piezoelectric layer are (0, 20, 0) to (0, 50, 0), (90, 90, 25) to (90, 90, 44), or (0, 95, 0) to (0, 132, 0); or

Euler Angles of the LiTaO 3 of the piezoelectric layer are (0, 12, 0) to (0, 48, 0), (90, 90, 13) to (90, 90, 36), or (0, 100, 0) to (0, 134, 0).

2. The elastic wave device according to claim 1 , wherein the high-impedance layer is made of at least one material selected from the group consisting of LiTaO 3 , AI 2 O 3 , AIN, LiNbO 3 , SiN, and ZnO.

3. A method for manufacturing the elastic wave device according to claim 1 , comprising:

forming the acoustic reflection layer on the supporting substrate;

putting the piezoelectric layer on the acoustic reflection layer; and

forming the IDT electrode on the piezoelectric layer.

4. The method for manufacturing an elastic wave device according to claim 3 , wherein the piezoelectric layer is formed on the acoustic reflection layer by bonding a piezoelectric layer onto the acoustic layer and making the piezoelectric layer thinner.

5. The method for manufacturing an elastic wave device according to claim 3 , wherein the piezoelectric layer is put on the acoustic reflection layer by producing the piezoelectric layer in a form of a film on the acoustic reflection layer.

6. A method for manufacturing the elastic wave device according to claim 1 , comprising:

forming the acoustic reflection layer on a piezoelectric body thicker than the piezoelectric layer;

bonding the supporting substrate to a surface of the acoustic reflection layer opposite to a surface on which the piezoelectric body is disposed;

making the piezoelectric body thinner; and

forming the IDT electrode on the piezoelectric layer.

7. The elastic wave device according to claim 1 , further comprising a plurality of the high-acoustic-impedance layers and a plurality of the low-acoustic-impedance layers alternatingly stacked on each other in a stacking direction.

8. The elastic wave device according to claim 1 , further comprising reflectors arranged such that the IDT electrode is disposed between the reflectors to define a one-port elastic wave resonator.

9. The elastic wave device according to claim 8 , wherein the reflectors are made of at least one of Al, Cu, Pt, Au, Ti, Ni, Cr, Ag, W, Mo, Ta.

10. The elastic wave device according to claim 1 , further comprising one of a temperature compensation film, a protection film, and a frequency adjustment film disposed on the IDT electrode.

11. The elastic wave device according to claim 1 , further comprising at least one insulating film made of SiO 2 , SiN, or AI 2 O 3 disposed on the IDT electrode.

12. The method for manufacturing an elastic wave device according to claim 3 , further comprising forming a plurality of the high-acoustic-impedance layers and a plurality of the low-acoustic-impedance layers alternatingly stacked on each other in a stacking direction.

13. The method for manufacturing an elastic wave device according to claim 3 , further comprising forming reflectors such that the IDS electrode is disposed between the reflectors to define a one-port elastic wave resonator.

14. The method for manufacturing an elastic wave device according to claim 13 , wherein the reflectors are made of at least one of Al, Cu, Pt, Au, Ti, Ni, Cr, Ag, W, Mo, Ta.

15. The method for manufacturing an elastic wave device according to claim 3 , further comprising forming one of a temperature compensation film, a protection film, and a frequency adjustment film on the IDT electrode.

16. The method for manufacturing an elastic wave device according to claim 3 , further comprising forming at least one insulating film made of SiO 2 , SiN, or AI 2 O 3 on the IDT electrode.

17. The elastic wave device according to claim 1 , wherein

the elastic wave device is configured to propagate A 1 , S 0 , or SH 0 mode plate waves;

the A l plate waves are anti-symmetric mode Lamb waves having one node in the thickness direction of the piezoelectric layer;

the S 0 mode plate waves are symmetric mode Lamb waves having no node in the thickness direction of the piezoelectric layer;

the SH 0 mode waves are shear horizontal waves having no node in the thickness direction of the piezoelectric layer; and

the Euler Angles of the LiNbO 3 or LiTaO 3 of the piezoelectric layer fall within a range specified in Table 1:

TABLE 1

Piezoelectric material

Mode

LiNbO 3

LiTaO 3

A 1

(0, 20, 0) to (0, 50, 0)

(0, 12, 0) to (0, 48, 0)

S 0

(90, 90, 25) to (90, 90, 44)

(90, 90, 13) to (90, 90, 36)

SH 0

 (0, 95, 0) to (0, 132, 0)

(0, 100, 0) to (0, 134, 0).

18. The elastic wave device according to claim 17 , wherein the high-impedance layer is made of at least one material selected from the group consisting of LiTaO 3 , AI 2 O 3 , AIN, LiNbO 3 , SiN, and ZnO.