Circuit board, electronic device, and method of manufacturing circuit board
A circuit board includes: a first surface and a second surface opposite to the first surface; a through hole extending between the first surface and the second surface; a conductor covering an inner wall surface of the through hole, a first end and a second end of the conductor being terminated inside the through hole; and a wire connected to the conductor, wherein a sum of a length from a contact portion where the conductor contacts a connector pin inserted in the through hole to the first end of the conductor, and a length from a wire connecting portion where the conductor is connected to the wire to the second end of the conductor is 0.5 mm or less.
1. A circuit board comprising:
a first surface and a second surface opposite to the first surface;
a through hole extending between the first surface and the second surface;
a conductor covering an inner wall surface of the through hole, a first end and a second end of the conductor being terminated inside the through hole; and
a wire connected to the conductor, wherein
a sum of a length from a contact portion where the conductor contacts a connector pin inserted in the through hole to the first end of the conductor, and a length from a wire connecting portion where the conductor is connected to the wire to the second end of the conductor is 0.5 mm or less.
2. The circuit board according to claim 1 , wherein
the contact portion and the wire connecting portion are disposed at the same position in a depth direction in the through hole.
3. The circuit board according to claim 1 , wherein
the contact portion is disposed at a position of 1 mm or more from one of the first surface and the second surface from which the connector pin is inserted.
4. The circuit board according to claim 1 , further comprising:
a plurality of wiring layers including a wiring layer having the wire formed therein; and
a plurality of insulator layers, wherein
the wiring layers and the insulator layers are alternately laminated.
5. A method of manufacturing a circuit board, the method comprising:
forming a laminated board in which a wiring layer having a wire and an insulator layer are laminated;
forming a through hole extending between first and second surfaces of the laminated board, the second surface being opposite to the first surface;
forming a conductor on an inner wall surface of the through hole such that the conductor is connected to the wire; and
removing an end portion of the conductor near the first surface and an end portion of the conductor near the second surface such that a sum of a length from a contact portion where the conductor contacts a connector pin inserted in the through hole to a first end of the conductor, and a length from a wire connecting portion where the conductor is connected to the wire to a second end of the conductor is 0.5 mm or less.
6. The manufacturing method according to claim 5 , further comprising
removing the end portion of the conductor near the first surface and the end portion of the conductor near the second surface by inserting a drill from the first surface and the second surface.
7. An electronic device comprising:
a first circuit board having a first wire;
a second circuit board having a second wire; and
a connector connecting the first wire to the second wire; wherein
each of the first circuit board and the second circuit board includes:
a first surface and a second surface opposite to the first surface;
a through hole extending between the first surface and the second surface; and
a conductor covering an inner wall surface of the through hole, a first end and a second end of the conductor being terminated inside the through hole, the conductor being connected to the corresponding one of the first wire and the second wire, and
in each of the first circuit board and the second circuit board, a sum of a length from a contact portion where the conductor contacts a connector pin inserted into the through hole to the first end of the conductor, and a length from a wire connecting portion where the conductor is connected to the first wire or the second wire to the second end of the conductor is 0.5 mm or less.
8. The electronic device according to claim 7 , wherein
the contact portion and the wire connecting portion are disposed at the same position in a depth direction in the through hole in at least one of the first circuit board and the second circuit board.
9. The electronic device according to claim 7 , wherein
the contact portion is disposed at a position of 1 mm or more from one of the first surface and the second surface from which the connector pin is inserted in at least one of the first circuit board and the second circuit board.
10. The electronic device according to claim 7 , wherein
the first circuit board includes a plurality of insulator layers and a plurality of wiring layers including a wiring layer having the first wire formed therein, the wiring layers and the insulator layers being alternately laminated, and
the second circuit board includes a plurality of insulator layers and a plurality of wiring layers including a wiring layer having the second wire formed therein, the wiring layers and the insulator layers being alternately laminated.