Wafer-scale pixelated detector system
A large area, gapless, detection system comprises at least one sensor; an interposer operably connected to the at least one sensor; and at least one application specific integrated circuit operably connected to the sensor via the interposer wherein the detection system provides high dynamic range while maintaining small pixel area and low power dissipation. Thereby the invention provides methods and systems for a wafer-scale gapless and seamless detector systems with small pixels, which have both high dynamic range and low power dissipation.
1. A detection system comprising:
a monolithic pixilated sensor comprising a uniformly segmented pixilated sensing material wherein at least one sensor pixel is defined by said segmentation of said pixilated sensing material;
an interposer comprising one or more substrates, two or more conducting layers configured on said substrates said conducting layers being isolated by one or more dielectric layers, a plurality of electrically conducting inter-layer via connections, and a plurality of electrically conducting thru holes in said substrate arranged such that one of said conducting layers is operably and mechanically connected to said monolithic pixilated sensor, wherein said interposer is physically sized to be equal to or greater than a physical size of said uniformly segmented sensor area;
a plurality of application specific integrated circuits further comprising a plurality of pixels associated with each of said plurality of application specific integrated circuits arranged such that one of said conducting layers is operably connected to said plurality of application specific integrated circuits;
wherein every of said at least one sensor pixel has a corresponding ASIC pixel comprising an analog front-end configured to process an input signal via a bipolar current splitter, said bipolar current splitter comprising a passive integrator and at least one current splitter configured to simultaneously integrate a split current over a plurality of ranges wherein each of said plurality of ranges is of a different scale;
wherein said interposer provides pitch adaptation between said monolithic pixilated sensor and said plurality of pixels associated with each of said plurality of application specific integrated circuits; and
wherein said monolithic pixilated sensor, said interposer, and said plurality of application specific integrated circuits are fabricated independently and merged to form said detection system.
2. The system of claim 1 wherein said interposer further comprises:
a plurality of routing traces on said at least one of said at least two conducting layers; and
at least one pad configured to bond components to said interposer.
3. The system of claim 2 wherein said interposer connects said at least one sensor pixel and said corresponding ASIC pixel associated with one of said plurality of application specific integrated circuits with said plurality of electrically conducting inter-layer via connections isolating said two or more conducting layers such that the stray capacitance of the connection between said at least one sensor pixel and said corresponding ASIC pixel is minimized.
4. The system of claim 2 wherein said interposer is configured as a pitch adaptor between said at least one sensor pixel and said corresponding ASIC pixel associated with one of said plurality of application specific integrated circuits, wherein each of said plurality of application specific integrated circuits have more than one circuit topologies configured to produce different functionality.
5. The system of claim 1 wherein said Monolith c pixilated sensor comprises at least one million pixels.
6. A method for gapless data detection comprising:
configuring a monolithic pixilated sensor with a uniformly segmented sensor area to collect incident electromagnetic radiation wherein said monolithic pixilated sensor comprises a pixilated sensing material;
defining at least one sensor pixel by segmentation of said pixilated sensing material configured to produce charge signals in response to incident electromagnetic radiation;
configuring an interposer to be physically sized to be equal to or greater than a physical size of said uniformly segmented sensor area wherein said interposer comprises one or more substrates, two or more conducting layers configured on said substrates said conducting layers being isolated by one or more dielectric layers, a plurality of electrically conducting inter-layer via connections, and a plurality of electrically conducting thru holes in said substrate arranged such that one of said conducting layers is operably and mechanically connected to said monolithic pixilated sensor;
connecting a plurality of application specific integrated circuits, to one of said conducting layers, said plurality of application specific integrated circuits further comprising a plurality of pixels associated with each of said plurality of application specific integrated circuits, said ASIC pixels further comprising an analog front-end configured to process an input signal via a bipolar current splitter;
associating every of said at least one sensor pixel with a corresponding ASIC pixel wherein said ASIC pixel is smaller than said sensor pixel;
simultaneously integrating a split current over a plurality of ranges with said bipolar current splitter, comprising a passive integrator and at least one current splitter, wherein each of said plurality of ranges is of a different scale;
providing pitch adaptation between said monolithic pixilated sensor and said plurality of pixels associated with each of said plurality of application specific integrated circuits with said interposer; and
merging said monolithic pixilated sensor, said interposer, and said plurality of application specific integrated circuits during fabrication to form said detection system.
7. The method of claim 6 further comprising:
configuring said interposer as a plurality of routing traces on said at least one of said at least two conducting layers; and,
at least one pad configured to bond components to said interposer.
8. The method of claim 7 further comprising
connecting said at least one sensor pixel and said corresponding ASIC pixel associated with one of said plurality of application specific integrated circuits with said plurality of electrically conducting inter-layer via connections isolating said two or more conducting layers such that the stray capacitance of the connection between said at least one sensor pixel and said corresponding ASIC pixel is minimized.
9. The method of claim 8 further comprising:
configuring said interposer as a pitch adaptor between said at least one sensor pixel and said corresponding ASIC pixel associated with one of said plurality of application specific integrated circuits wherein each of said plurality of application specific integrated circuits have more than one circuit topologies configured to produce different functionality.
10. The method of claim 6 wherein said monolithic pixilated sensor comprises at least one million pixels.
11. A large area, gapless, detection apparatus comprising:
a monolithic pixilated sensor comprising a uniformly segmented pixilated sensing material wherein at least one sensor pixel is defined by said segmentation of said pixilated sensing material;
an interposer comprising one or more substrates, two or more conducting layers configured on said substrates said conducting layers being isolated by one or more dielectric layers, a plurality of electrically conducting inter-layer via connections, and a plurality of electrically conducting thru holes in said substrate arranged such that one of said conducting layers is operably and mechanically connected to said monolithic pixilated sensor, wherein said interposer is physically sized to be equal to or greater than a physical size of said uniformly segmented sensor area;
a plurality of application specific integrated circuits further comprising a plurality of pixels associated with each of said plurality of application specific integrated circuits arranged such that one of said conducting layers is operably connected to said plurality of application specific integrated circuits;
wherein every of said at least one sensor pixel has a corresponding ASIC pixel comprising an analog front-end configured to process an input signal via a bipolar current splitter, said bipolar current splitter comprising a passive integrator and at least one current splitter configured to simultaneously integrate a split current over a plurality of ranges wherein each of said plurality of ranges is of a different scale;
wherein said interposer provides pitch adaptation between said monolithic pixilated sensor and said plurality of pixels associated with each of said plurality of application specific integrated circuits; and
wherein said monolithic pixilated sensor, said interposer, and said plurality of application specific integrated circuits are fabricated independently and merged to form said detection apparatus.
12. The apparatus of claim 11 wherein said monolithic pixilated sensor further comprises a pixilated sensing material configured to produce charge signals in response to incident electromagnetic radiation and wherein at least one sensor pixel is defined by said segmentation of said pixilated sensing material; and
wherein said interposer further comprises:
a plurality of routing traces on said at least one of said at least two conducting layers; and
at least one pad configured to bond components to said interposer.