Mounting structure and method for manufacturing same
A mounting structure includes a bonding material ( 106 ) that bonds second electrodes ( 104 ) of a circuit board ( 105 ) and bumps ( 103 ) of a semiconductor package ( 101 ), the bonding material ( 106 ) being surrounded by a first reinforcing resin ( 107 ). Moreover, a portion between the outer periphery of the semiconductor package ( 101 ) and the circuit board ( 105 ) is covered with a second reinforcing resin ( 108 ). Even if the bonding material ( 106 ) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.
1. A mounting structure, comprising:
a semiconductor package having first electrodes;
a circuit board having second electrodes;
a bonding material containing solder that is disposed between the second electrode and a bump formed on the first electrode and electrically bonds the bump and the second electrode;
a first reinforcing resin covering a circumference of the bonding material; and
a second reinforcing resin covering a portion between an outer periphery of the semiconductor package disposed on the circuit board and the circuit board,
wherein a relationship is established: a melting point of the bump>a hardening reaction starting temperature of the second reinforcing resin≧a hardening reaction starting temperature of the first reinforcing resin>a melting point of the bonding material, and
the first reinforcing resin and the second reinforcing resin do not contact each other.
2. The mounting structure according to claim 1 , wherein the bump contains a solder material.
3. The mounting structure according to claim 1 , wherein the first reinforcing resin and the second reinforcing resin are in contact with each other.
4. The mounting structure according to claim 1 , wherein the first reinforcing resin and the second reinforcing resin contain resin components with an identical composition and contain different curing agents.
5. The mounting structure according to claim 1 , wherein the bump has an alloy composition of a Sn material, and the bonding material is a Sn material.
6. The mounting structure according to claim 1 , wherein the bump has an alloy composition of SnAgCu solder, and the bonding material is a SnBi material.
7. The mounting structure according to claim 1 , wherein
a temperature difference between a melting point of the bonding material and hardening reaction starting temperatures of the first reinforcing resin and the second reinforcing resin is 2° C. to 17° C.
8. The mounting structure according to claim 1 , wherein the second reinforcing resin contacts the semiconductor package and the circuit board.
9. The mounting structure according to claim 1 , wherein the first reinforcing resin and the second reinforcing resin comprise a thermosetting resin and a curing agent.
10. A mounting structure comprising:
a semiconductor package having first electrodes;
a circuit board having second electrodes;
a bonding material containing solder that is disposed between the second electrode and a bump formed on the first electrode and electrically bonds the bump and the second electrode;
a first reinforcing resin covering a circumference of the bonding material; and
a second reinforcing resin covering a portion between an outer periphery of the semiconductor package disposed on the circuit board and the circuit board,
wherein a relationship is established: a melting point of the bump>a hardening reaction starting temperature of the second reinforcing resin≧a hardening reaction starting temperature of the first reinforcing resin>a melting point of the bonding material, and
a difference between a hardening reaction starting temperature of the first reinforcing resin and a hardening reaction starting temperature of the second reinforcing resin is 5° C. to 15° C.