Inspection apparatus, inspection method and manufacturing method

1. An inspection apparatus for identifying a defect in a product structure, the apparatus comprising:

an illumination optical system configured to provide a spot of radiation on the product structure;

an image detector configured to capture a diffraction pattern formed by the spot of radiation scattering by the product structure; and

a processor configured to:

receive image data representing the captured diffraction pattern,

receive reference data describing a nominal product structure,

calculate, from the image data, a synthetic image of the product structure, and

compare data from the synthetic image with the reference data to identify the defect in the product structure.

2. The inspection apparatus of claim 1 , wherein:

the inspection apparatus is configured to obtain a plurality of diffraction patterns using a series of two or more spots of radiation displaced from one another but overlapping one another, and

the processor is configured to calculate the synthetic image using the plurality of diffraction patterns and to use a relative displacement of the two or more spots of radiation to perform phase retrieval.

3. The inspection apparatus of claim 2 , wherein the processor is further configured to use the reference data in the calculating the synthetic image.

4. The inspection apparatus of claim 3 , wherein the processor is further configured to use the reference data to calculate an initial phase estimate corresponding to the captured diffraction pattern.

5. The inspection apparatus of claim 1 , wherein:

the reference data is an image of the nominal product structure; and

the synthetic image is compared with the image of the nominal structure to identify the defect.

6. The inspection apparatus of claim 1 , further comprising a radiation source comprising a high harmonic generator and a pump laser.

7. The inspection apparatus of claim 1 , further comprising a wavelength selector for selecting a wavelength of the radiation.

8. The inspection apparatus of claim 1 , further comprising a radiation source, wherein the radiation source and the illumination optical system are configured to provide the radiation having a wavelength less than 125 nm.

9. The inspection apparatus of claim 1 , wherein the illumination optical system is configured to deliver the spot of radiation with a diameter less than 15 μm.

10. The inspection apparatus of claim 1 , wherein the inspection apparatus is configured to process automatically a series of product structures that have been formed on a semiconductor substrate.

11. A method of identifying a defect in a product structure, the method comprising:

providing radiation on the product structure;

capturing a diffraction pattern formed by the radiation scattering by the product structure;

receiving image data representing the captured diffraction pattern;

receiving reference data describing a nominal product structure;

calculating, from the image data, a synthetic image of the product structure; and

comparing data from the synthetic image with the reference data to identify a defect in the product structure.

12. The method of in claim 11 , further comprising:

repeating the providing and the capturing to obtain a plurality of diffraction patterns using a series of two or more spots of radiation displaced from one another but overlapping one another;

using the plurality of diffraction patterns to calculate the synthetic image; and

using a relative displacement of the spots to perform phase retrieval.

13. The method of claim 12 , further comprising using the reference data in the calculating the synthetic image.

14. The method of claim 13 , further comprising using the reference data to calculates an initial phase estimate corresponding to the captured diffraction pattern.

15. The method of claim 11 , wherein:

the reference data is an image of the nominal structure; and

the calculating comprises comparing the synthetic image with the image of the nominal structure to identify the defect.

16. The method of claim 11 , further comprising selecting a wavelength of the provided radiation from a range of wavelengths generated by a radiation source.

17. A method of manufacturing devices, comprising:

forming device features and metrology targets on a series of substrates by a lithographic process;

identifying defects on one or more processed substrates by:

providing a spot of radiation on the device features or the metrology targets;

capturing a diffraction pattern formed by the spot of radiation scattering by the device features or the metrology targets;

receiving reference data describing nominal device features or nominal metrology targets;

calculating from the captured diffraction pattern a synthetic image of the device features or metrology targets; and

comparing data from the synthetic image with the reference data to identify a defect in the device features or the metrology targets; and

adjusting parameters of the lithographic process for processing of further substrates based on the identified defect.

18. A non-transitory computer program product comprising machine-readable instructions for causing a processor to perform operations comprising:

providing a spot of radiation on a product structure;

capturing a diffraction pattern formed by the spot of radiation scattering by the product structure;

receiving reference data describing a nominal product structure;

calculating, from the captured diffraction pattern, a synthetic image of the product structure; and

comparing data from the synthetic image with the reference data to identify a defect in the product structure.

19. A method of manufacturing devices, comprising:

forming device features and metrology targets on a series of substrates by a lithographic process,

identifying defects on one or more processed substrates by:

providing a spot of radiation on the device features or the metrology targets;

capturing at least one diffraction pattern formed by the spot of radiation scattering by the device features or the metrology targets;

receiving reference data describing nominal device features or nominal metrology targets;

calculating, from the captured diffraction pattern, a synthetic image of the device features or the metrology targets; and

comparing data from the synthetic image with the reference data to identify a defect in the device features or the metrology targets, and

trigger an intervention in handling of the substrate having the identified defect based on the identifying defects.

20. The inspection apparatus of claim 1 , wherein the processor is further configured to use auxiliary data associated with the radiation in the calculating the synthetic image.

21. The inspection apparatus of claim 1 , further comprising a radiation source, wherein the radiation source and the illumination optical system are configured to provide the radiation having a wavelength less than 50 nm.