Adjacent device isolation

1. A method for altering a work function material of a first isolation transistor and a second isolation transistor within an integrated circuit (IC) device, the method comprising:

doping, with a first-type channel dopant concentration, a sub-fin portion of a first-type active transistor and a sub-fin portion of the first isolation transistor adjacent to the first-type active transistor within a first-type region;

doping, with a second-type channel dopant concentration, a sub-fin portion of a second-type active transistor and a sub-fin portion of the second isolation transistor adjacent to the second-type active transistor within a second-type region;

depositing a first-type work function material on the first-type active transistor within the first-type region and on the second-type active transistor within the second-type region adjacent to the first-type active transistor;

depositing the first-type work function material on the first isolation transistor within the first-type region and on the second isolation transistor within the second-type region adjacent to the first isolation transistor;

exposing the first-type work function material of the first isolation transistor within the first-type region and the first-type work function material of the second-type active transistor within the second-type region;

etching the first-type work function material of the first isolation transistor and the second-type active transistor to concurrently form a second-type work function material for the first isolation transistor within the first-type region and the second-type active transistor within the second-type region; and

depositing a conductive fill material on the second-type work function material of the first isolation transistor and the second-type active transistor.

2. The method of claim 1 , further comprising biasing a gate of the first isolation transistor and a gate of the second isolation transistor to place the first isolation transistor and the second isolation transistor in an OFF state.

3. The method of claim 1 , further comprising doping a source/drain portion of the first-type active transistor and the first isolation transistor using a solid state dopant.

4. The method of claim 1 , in which exposing comprises:

depositing a mask to define openings to the first isolation transistor and the second-type active transistor within alternating n-type regions and p-type regions; and

performing a strip resist process to expose the first isolation transistor and the second-type active transistor within the alternating n-type regions and p-type regions.

5. The method of claim 1 , in which the IC device is integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit.

6. A method for altering a work function material of a first isolation transistor and a second isolation transistor within an integrated circuit (IC) device, the method comprising:

the step for doping, with a first-type channel dopant concentration, a sub-fin portion of a first-type active transistor and a sub-fin portion of the first isolation transistor adjacent to the first-type active transistor in a first-type region;

the step for doping, with a second-type channel dopant concentration, a sub-fin portion of a second-type active transistor and a sub-fin portion of the second isolation transistor adjacent to the second-type active transistor in a second-type region;

the step for depositing a first-type work function material on the first-type active transistor within the first-type region and on the second-type active transistor within the second-type region adjacent to the first-type active transistor;

the step for depositing a second-type work function material on the first isolation transistor within the first-type region and on the second isolation transistor within the second-type region adjacent to the first isolation transistor;

the step for exposing the first-type work function material of the first isolation transistor within the first-type region and the first-type work function material of the second-type active transistor within the second-type region;

the step for etching the first-type work function material of the first isolation transistor and the second-type active transistor to concurrently form a second-type work function material for the first isolation transistor within the first-type region and the second-type active transistor within the second-type region; and

the step for depositing a conductive fill material on the second-type work function material of the first isolation transistor and the second-type active transistor.

7. The method of claim 6 , further comprising the step for biasing a gate of the first isolation transistor and the second isolation transistor to place the first isolation transistor and the second isolation transistor in an OFF state.

8. The method of claim 6 , further comprising the step for doping a source/drain portion of the first-type active transistor and the first isolation transistor using a solid state dopant.

9. The method of claim 6 , in which the step for exposing comprises:

the step for depositing a mask to define openings to the first isolation transistor and the second-type active transistor within alternating n-type regions and p-type regions; and

the step for performing a strip resist process to expose the first isolation transistor and the second-type active transistor within the alternating n-type regions and p-type regions.

10. The method of claim 6 , in which the IC device is integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit.