Electronic device and method for manufacturing housing of the electronic device
An electronic device includes an inner case, at least one radiator disposed on a surface of the inner case, and an outer case integrally formed on the surface of the inner case, in which the outer case at least partially conceals the radiator. A method for manufacturing a housing of an electronic device includes molding an inner member by injecting resin into an injection mold, extracting the inner member from the mold, forming or disposing a conductive pattern on a surface of the inner member, inserting the inner member comprising the conductive pattern into another injection mold, and molding a periphery member that encloses at least a portion of the inner member by injecting resin to the other injection mold, wherein rigidity or stiffness of the inner member is higher than that of the periphery member. Other embodiments are also disclosed.
1. An electronic device comprising:
a housing comprising a front side and a back side facing an opposite side of the front side;
a periphery member forming at least a portion of an edge of the housing, and comprising a non-metallic material;
an inner member that forms at least a portion of the housing inside the periphery member, along at least a portion of the edge in adjacent to the periphery member, and comprises a metallic material, the inner member further comprising a rear surface portion forming at least a portion of the back side of the housing and a side portion extending from the rear surface portion along the edge; and
a conductive pattern, at least a portion of which being inserted between the periphery member and the inner member,
wherein the inner member has higher rigidity or stiffness than the periphery member,
wherein the periphery member is formed to enclose at least a portion of the rear surface portion or the side portion,
wherein at least a portion of the conductive pattern is formed in the side portion of the inner member, facing the front side of the housing.
2. The electronic device of claim 1 , wherein at least a portion of the conductive pattern is disposed between the side portion and the periphery member.
3. The electronic device of claim 1 , wherein the inner member substantially has a rectangular frame shape in adjacent to the edge of the housing or has a frame shape, in at least a portion of which a gap is formed.
4. The electronic device of claim 3 , further comprising:
a bracket that is coupled to a portion of the side portion of the inner member and faces the front side; and
a window member at least partially contained in a space formed by the bracket and the side portion.
5. The electronic device of claim 4 , further comprising:
a sealing member interposed between at least a portion of an edge of the window member and at least a portion of the side portion of the inner member.
6. The electronic device of claim 4 , wherein the window member is positioned to be enclosed by the periphery member and a portion of an inner surface of the window member is directly or indirectly supported on the side portion.
7. The electronic device of claim 6 , further comprising:
a support rib formed in an edge of the bracket,
wherein the bracket is disposed to face the inner surface of the window member and the support rib is interposed between the side portion and the window member.
8. The electronic device of claim 1 , wherein the conductive pattern extends from an outer surface of the side portion to an inner surface of the inner member through an outer surface of the rear surface portion.
9. The electronic device of claim 1 , further comprising:
an opening formed to pass through the side portion of the inner member; and
an accessory member made of a conductive material in the opening,
wherein the accessory member is electrically connected to the conductive pattern.
10. The electronic device of claim 9 , wherein the accessory member comprises at least one of a mesh grill for a speaker output hole, a key, an interface connector deco, a camera deco or cover.
11. The electronic device of claim 1 , further comprising:
an auxiliary member coupled to enclose at least a portion of the inner member; and
another conductive pattern disposed on a surface of the auxiliary member.
12. The electronic device of claim 1 , further comprising:
a sensor module connected to the conductive pattern, wherein the sensor module is configured to detect an approach or contact of a conductor from a change in a capacitance or a resistance of the conductive pattern.
13. The electronic device of claim 1 , further comprising:
a communication module;
an antenna feed contacting the conductive pattern; and
a wiring portion electrically connecting the antenna feed with the communication module.
14. An electronic device comprising:
a housing including a front side and a back side facing an opposite side of the front side;
a periphery member forming at least a portion of an edge of the housing, and comprising a non-metallic material;
an inner member that forms at least a portion of the housing inside the periphery member, along at least a portion of the edge in adjacent to the periphery member, and comprises a metallic material, the inner member further comprising a rear surface portion forming at least a portion of the back side of the housing and a side portion extending from the rear surface portion along the edge;
a bracket that is coupled to a portion of the side portion of the inner member and faces the front side;
a window member at least partially contained in a space formed by the bracket and the side portion; and
a conductive pattern, at least a portion of which being inserted between the periphery member and the inner member,
wherein the inner member has higher rigidity or stiffness than the periphery member,
wherein the periphery member is formed to enclose at least a portion of the rear surface portion or the side portion,
wherein the inner member substantially has a rectangular frame shape in adjacent to the edge of the housing or has a frame shape, in at least a portion of which a gap is formed, and
wherein at least a portion of the conductive pattern is formed in the side portion of the inner member, facing the front side of the housing.