Formulated resin compositions for flood coating electronic circuit assemblies
Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations.
1. A flood coat composition comprising a multi-part polymeric resin system comprising an epoxy-polyurethane hybrid resin, wherein said flood coat composition is characterized by having a gel time from 5 to 15 minutes, and a thixotropic index from 3 to 5, such that when cured, the flood coat composition provides a Shore hardness from 40A to 85D.
2. A flood coat composition according to claim 1 , wherein the polyurethane resin system includes castor oil.
3. A flood coat composition according to claim 1 , wherein the polymeric resin system further includes one or more defoamer, plasticizer, or rheology agent.
4. An electrical circuit assembly comprising a base support with a plurality of electrical circuit components extending outwardly from the surface of the base support attached thereto and electrically connected to the electrical circuitry, wherein the electrical circuit assembly is flood coated with a predetermined volume of a flood coat composition as defined in claim 1 such that the flood coat composition substantially covers or encapsulates the electrical circuit assembly as a fixed mass upon cure and has a thickness on component surfaces horizontal to the base support from 20 mils to 75 mils and a thickness on component surfaces perpendicular to the base support from 4 mils to 20 mils.
5. An electrical circuit assembly according to claim 4 , wherein the thickness of the flood coat composition on component surfaces horizontal to the base support is greater than 20 mils and less than 70 mils.
6. An electrical circuit assembly according to claim 4 , wherein the thickness of the flood coat composition on component surfaces perpendicular to the base support is greater than 4 mils and less than 20 mils.
7. An electrical circuit assembly according to claim 4 , wherein said assembly is housed within an electronic device.
8. An electrical circuit assembly according to claim 4 , further characterized by having improved mechanical support and environmental protection when exposed to temperature extremes and/or vibration.
9. An electrical circuit assembly comprising a base support with a plurality of electrical circuit components extending outwardly from the surface of the base support attached thereto and electrically connected to the electrical circuitry, wherein the electrical circuit assembly is flood coated with a predetermined volume of a flood coat composition comprising a multi-part polymeric resin system selected from the group consisting of epoxy, epoxy-polyurethane hybrid, silicone, acrylic, or mixtures thereof to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure, said flood coat composition having a sufficient gel time and thixotropic index such that the thickness of the flood coat composition on component surfaces horizontal to the base support is from 20 mils to 75 mils, and the thickness of the flood coat composition on component surfaces perpendicular to the base support is from 4 mils to 20 mils upon cure.
10. An electrical circuit assembly according to claim 9 , wherein the thickness of the flood coat composition on component surfaces horizontal to the base support is greater than 20 mils and less than 70 mils.
11. An electrical circuit assembly according to claim 9 , wherein the thickness of the flood coat composition on component surfaces perpendicular to the base support is greater than 4 mils and less than 20 mils.
12. An electrical circuit assembly according to claim 9 , wherein the flood coat composition has a Shore hardness from 15A to 85D upon cure.
13. An electrical circuit assembly according to claim 9 , wherein the flood coat composition has a gel time from 5 minutes to 15 minutes.
14. An electrical circuit assembly according to claim 9 , wherein the thixotropic index is from 1 to 1.5.
15. An electrical circuit assembly according to claim 9 , wherein the multi-part polymeric resin system comprises the epoxy-polyurethane hybrid, and the epoxy-polyurethane hybrid comprises castor oil.
16. An electrical circuit assembly according to claim 9 , wherein the polymeric resin comprises silicone and the thixotropic index is from 1 to 5.
17. An electrical circuit assembly according to claim 12 , wherein the Shore hardness is from 30A to 90A.
18. An electrical circuit assembly according to claim 9 , wherein the polymeric resin system includes epoxy functional groups and the thixotropic index is from 3 to 5.
19. An electrical circuit assembly according to claim 18 , wherein the Shore hardness is from 40A to 85D.
20. An electrical circuit assembly according to claim 5 , wherein the flood coat composition has a weight from 60 grams to 150 grams.
21. An electrical circuit assembly according to claim 20 , wherein the weight is greater than 60 grams and less than 100 grams.
22. An electrical circuit assembly according to claim 9 , further characterized by having improved mechanical support and environmental protection when exposed to temperature extremes and/or vibration.
23. A flood coat composition according to claim 1 , further characterized by having an initial mix viscosity of 5,000 to 40,000 cP.
24. A flood coat composition according to claim 23 , further characterized by having an initial mix viscosity of 8,000 to 12,000 cP.