Light emitting device package and light emitting device package module

1. A light emitting device package comprising:

a base including a cavity;

a first light emitting device disposed in the cavity, the first light emitting device including a first light emitting element configured to produce light having a first peak wavelength and a first fluorescent layer covering a top surface and a side surface of the first light emitting element;

a second light emitting device disposed in the cavity, the second light emitting device including a second light emitting element configured to produce light having a second peak wavelength and a second fluorescent layer covering a top and side surfaces-of the second light emitting element; and

a molding member configured to fill the cavity, the molding member being disposed on the first light emitting device and the second light emitting device, and the molding member including a molding spacing portion disposed between the first light emitting device and the second light emitting device so as to separate the first light emitting device and the second light emitting device,

wherein the first fluorescent layer is configured to convert the light having the first peak wavelength of the first light emitting element to light having a third peak wavelength, and the second fluorescent layer is configured to convert the light having the second peak wavelength of the second light emitting element to light having a fourth peak wavelength,

wherein an edge of the molding member is configured to define a sealing portion which is disposed on a portion of a top of the base surrounding the cavity, and

wherein the sealing portion of the molding member includes a slope profile and a flat profile, the slope profile is extended from a central portion of the molding member and includes a predetermined gradient in a side direction and the flat profile is extended from the slope profile and includes a gradient of substantially zero.

2. The light emitting device package of claim 1 , wherein the first light emitting device and the second light emitting device each comprise a flip-chip type light emitting diode (LED).

3. The light emitting device package of claim 1 , wherein the first fluorescent layer or the second fluorescent layer comprises at least one of yttrium aluminum garnet (YAG), terbium aluminum garnet (TAG), lutetium aluminum garnet (LuAG), silicate, nitride, oxynitride, and sulfide.

4. The light emitting device package of claim 1 , wherein:

the first light emitting element comprises a first blue light emitting diode (LED) configured to emit the light having the first peak wavelength in a range of about 380 nm and about 450 nm, and the first fluorescent layer is configured to convert the light having the first peak wavelength to light having the third peak wavelength in a range of about 510 nm and about 550 nm.

5. The light emitting device package of claim 1 , wherein:

the second light emitting element comprises a second blue light emitting diode (LED) configured to emit the light having the second peak wavelength in a range of about 380 nm and about 450 nm, and

the second fluorescent layer is configured to convert the light having the second peak wavelength to the light having the fourth peak wavelength in a range of about 600 nm and about 650 nm.

6. The light emitting device package of claim 1 , wherein the base further includes a plurality of reflecting surfaces configured to reflect light from the first light emitting device and the second light emitting device towards a center of the cavity.

7. The light emitting device package of claim 1 , further comprising a terminal for power supply.

8. The light emitting device package of claim 1 , wherein the molding member comprises a plurality of profiles at edges of the molding member.

9. A light emitting device package module, comprising:

a circuit board; and

a plurality of light emitting device packages coupled to the circuit board, wherein each of the plurality of light emitting device packages comprises:

a base including a cavity;

a first light emitting device disposed in the cavity, the first light emitting device including a first light emitting element configured to produce light having a first peak wavelength and a first fluorescent layer covering a top and side surfaces of the first light emitting element;

a second light emitting device disposed in the cavity, the second light emitting device including a second light emitting element configured to produce light having a second peak wavelength and a second fluorescent layer covering a top and side surfaces of the second light emitting element; and

a molding member configured to fill the cavity, the molding member being disposed on the first light emitting device and the second light emitting device, and the molding member including a molding spacing portion disposed between the first light emitting device and the second light emitting device so as to separate the first light emitting device and the second light emitting device,

wherein the first fluorescent layer is configured to convert the light having the first peak wavelength of the first light emitting element to light having a third peak wavelength, and the second fluorescent layer is configured to convert the light having the second peak wavelength of the second light emitting element to light having a fourth peak wavelength,

wherein an edge of the molding member is configured to define a sealing portion which is disposed on a portion of a top of the base surrounding the cavity, and

wherein the sealing portion of the molding member includes a slope profile and a flat profile, the slope profile is extended from a central portion of the molding member and includes a predetermined gradient in a side direction and the flat profile is extended from the slope profile and includes a gradient of substantially zero.

10. The light emitting device package module of claim 9 , further comprising:

a reflective sheet; and

a light guide plate disposed on the reflective sheet.