IP Library Granted Patent US 9,853,243
Granted Patent B2
US 9,853,243 · App. 14/899,939 · Granted Dec 26, 2017

Flexible display and method for fabricating the same

Inventor: Kuang-Jung Chen (Zhubei, TW)
Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
H01L51/5253H01L27/322H01L51/003H01L51/0097H01L51/524H01L51/5246H01L51/56H01L2227/323H01L2227/326H01L2251/5338
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Quick Facts
Patent No.
US 9,853,243
App. No.
14/899,939
Granted
Dec 26, 2017
Kind
B2
Abstract

The invention provides a flexible display and method for fabricating the same. The flexible display includes: a first flexible substrate and an oppositely disposed second flexible substrate; a TFT layer and an emitting unit, sequentially formed on the first flexible substrate; a color filter layer and an overcoat formed on the second flexible substrate; a fill formed between the first flexible substrate and the second flexible substrate; and a dam formed between the first flexible substrate and the second flexible substrate and surrounding the fill.

Claims (49)

1. A method for fabricating flexible displays, comprising:

providing a first rigid carrier substrate, wherein a first de-bonding area, a first flexible substrate, a thin film transistor layer, and a light emitting unit are formed on the first rigid carrier substrate;

providing a second rigid carrier substrate, wherein a second de-bonding area, a second flexible substrate, and a color filter layer are formed on the second rigid carrier substrate;

performing a first cutting step to cut the second de-bonding area and the second flexible substrate, wherein the second flexible substrate is divided into a first portion and a second portion;

assembling the first rigid carrier substrate and the second rigid carrier substrate together;

fixing the first rigid carrier substrate, and separating the second de-bonding area from the first portion of the second flexible substrate to expose a surface of the first portion of the second flexible substrate, and removing the second rigid carrier substrate and the second de-bonding area;

performing a second cutting step to cut the first de-bonding area and the first flexible substrate, wherein the first flexible substrate is divided into a third portion and a fourth portion, and the thin film transistor layer is formed on the third portion of the first flexible substrate; and

separating the first de-bonding area from the third portion of the first flexible substrate, and removing the first rigid carrier substrate and the first de-bonding area to form the flexible display.

2. The method for fabricating flexible displays as claimed in claim 1 , further comprising:

forming a first alignment mark on the first flexible substrate; and

forming a second alignment mark on the second flexible substrate, wherein the first alignment mark is aligned to the second alignment mark when the first rigid carrier substrate and the second rigid carrier substrate are assembled.

3. The method for fabricating flexible displays as claimed in claim 1 , wherein an area of the first de-bonding area is smaller than or equal to an area of the first flexible substrate, and an area of the second de-bonding area is smaller than or equal to an area of the second flexible substrate.

4. The method for fabricating flexible displays as claimed in claim 1 , wherein assembling the first rigid carrier substrate and the second rigid carrier substrate together comprises:

putting the first rigid carrier substrate and the second rigid carrier substrate in a vacuum chamber;

filling a fill between the first rigid carrier substrate and the second rigid carrier substrate; and

after the assembling step, removing the first rigid carrier substrate and the second rigid carrier substrate.

5. The method for fabricating flexible displays as claimed in claim 1 , before performing the first cutting step, further comprising:

forming an overcoat on the color filter layer.

6. The method for fabricating flexible displays as claimed in claim 5 , after performing the first cutting step, further comprising:

forming a dam on the first portion of the second flexible substrate, wherein the color filter layer and the light emitting unit are surrounded by the dam and the fill is located inside of the dam.

7. The method for fabricating flexible displays as claimed in claim 5 , before forming the overcoat, further comprising:

forming a sidewall barrier layer (SWB layer) on an edge of the second flexible substrate, wherein the color filter layer is surrounded by the sidewall barrier layer.

8. The method for fabricating flexible displays as claimed in claim 7 , after forming the overcoat, wherein the sidewall barrier layer is covered by the overcoat.

9. The method for fabricating flexible displays as claimed in claim 1 , further comprising:

forming a fill between the first rigid carrier substrate and the second rigid carrier substrate, wherein the fill is formed between the light emitting unit and the color filter layer.

10. The method for fabricating flexible displays as claimed in claim 1 , after separating the second de-bonding area from the first portion of the second flexible substrate, further comprising:

processing a surface of the first portion of the second flexible substrate.

11. The method for fabricating flexible displays as claimed in claim 1 , further comprising:

forming a conductive line out of a dam on an edge of the first flexible substrate; and

after separating the second de-bonding area from the first portion of the second flexible substrate, conductive line electrically connecting to a flexible printed circuit (FPC).

12. A flexible display, comprising:

a first flexible substrate and a second flexible substrate, wherein the first flexible substrate is disposed oppositely to the second flexible substrate;

a thin film transistor layer and a light emitting unit formed on the first flexible substrate;

a color filter layer formed on the second flexible substrate;

a sidewall barrier layer (SWB layer) formed between the first flexible substrate and the second flexible substrate, wherein the color filter layer and/or light emitting unit is surrounded by the sidewall barrier layer, wherein a height of the sidewall barrier layer is higher than that of the color filter layer;

an overcoat formed on the sidewall barrier layer (SWB layer) and on the color filter layer; and

a fill formed between the light emitting unit and the color filter.

13. The flexible display as claimed in claim 12 , further comprising:

a dam formed between the first flexible substrate and the second flexible substrate and surrounding the fill.

14. The flexible display as claimed in claim 13 , further comprising:

a conductive line formed out of the dam on an edge of the first flexible substrate; and

a flexible printed circuit (FPC) electrically connected to the conductive line.

15. The flexible display as claimed in claim 12 , wherein the fill comprises a comprehensive glue.

16. The flexible display as claimed in claim 12 , wherein the second flexible substrate has a first surface and a second surface, the color filter layer is formed on the first surface of the second flexible substrate, and a function layer is formed on the second surface of the second flexible substrate.

17. The flexible display as claimed in claim 12 , further comprising:

a touch unit formed below the color filter layer.

18. The flexible display as claimed in claim 12 , further comprising:

a touch unit formed on the color filter layer.

19. The flexible display as claimed in claim 12 , wherein the light emitting unit comprises a white organic light emitting diode (WOLED) or RGB organic light emitting diode (RGB OLED).

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2022
From: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
To: HANNSTAR DISPLAY CORPORATION
Reel/Frame 059365/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2015
From: CHEN, KUANG-JUNG
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 037371/0476 →
Continuity (1)
Related Publication 20160141552A1 · May 19, 2016