Method for manufacturing liquid ejecting head
Provided is a method for manufacturing a recording head having a head chip that ejects ink, an upstream flow path member, a downstream flow path member where an accommodating portion and a downstream flow path are disposed, a wiring member that is connected to a piezoelectric actuator in the head chip, a wiring substrate, a first insertion hole into which the wiring member and a tool are inserted, and a second insertion hole where a wiring member insertion portion into which the wiring member is inserted and a tool insertion portion into which the tool can be inserted are integrally formed, the method including inserting the tool into the tool insertion portion, holding the wiring member with the tool, withdrawing the tool from the tool insertion portion by moving the downstream flow path member to the head chip side, and inserting the wiring member into the wiring member insertion portion.
1. A method for manufacturing a liquid ejecting head including
a head chip that ejects a liquid from a liquid ejecting surface,
a first flow path member where a first flow path for the liquid is disposed,
a second flow path member is bonded to the first flow path member, where the second flow path member includes an accommodating portion that is open to the side opposite to the first flow path member and accommodates the head chip, and a second flow path for the liquid is open into the accommodating portion and is connected to the first flow path,
a wiring member is connected to a pressure generating unit which generates pressure change in a flow path in the head chip, and
a wiring substrate is arranged between the first flow path member and the second flow path member,
wherein the wiring member is inserted into a first insertion hole that is open to the first flow path member and the second flow path member side, the first insertion hole is formed in the wiring substrate, and the wiring member is inserted into a second insertion hole that is open to the accommodating portion and the wiring substrate side, the second insertion hole is formed in the second flow path member, and the wiring member is bonded to the wiring substrate, and
wherein the second insertion hole is formed so that a tool which holds the wiring member can be inserted,
the method comprising:
inserting the tool from the opening of the second insertion hole on the first flow path member side;
holding the wiring member that is connected to the pressure generating unit of the head chip with the tool; and
inserting the wiring member into the second insertion hole by relatively moving the tool with respect to the second flow path member so that the tool which holds the wiring member is separated from the second flow path member.
2. The method for manufacturing a liquid ejecting head according to claim 1 ,
wherein the first insertion hole of the wiring substrate is formed so that the tool which holds the wiring member can be inserted,
wherein the tool is inserted from the openings of the first insertion hole and the second insertion hole on the first flow path member side,
wherein the wiring member that is connected to the pressure generating unit of the head chip is held with the tool, and
wherein the wiring member is inserted into the first insertion hole and the second insertion hole by relatively moving the tool with respect to the wiring substrate and the second flow path member so that the tool which holds the wiring member is separated from the wiring substrate and the second flow path member.
3. The method for manufacturing a liquid ejecting head according to claim 1 ,
wherein the head chip is fixed to a fixing member that is fixed to the second flow path member, and
wherein the wiring member that is connected to the head chip which is fixed to the fixing member is held by using the tool.
4. The method for manufacturing a liquid ejecting head according to claim 1 ,
wherein a wiring member insertion portion into which the wiring member is inserted and a tool insertion portion into which the tool is inserted are integrally formed in at least one of the first insertion hole and the second insertion hole,
wherein the tool is inserted into the tool insertion portion, and
wherein the wiring member is inserted into the wiring member insertion portion by relatively moving the tool with respect to the second flow path member so that the tool which holds the wiring member is separated from the second flow path member.