Connector for waveguide and alignment method

1. A connector for coupling optical signals to a semiconductor device, the connector comprising:

a connector member comprising a recessed portion to arrange a plurality of waveguides formed side-by-side in a transverse direction; and

a backup member arranged within the recessed portion interposing the plurality of waveguides between the connector member and the backup member, wherein

the recessed portion comprises a plurality of ridges arranged in a staggered pattern relative to the plurality of waveguides for positioning the plurality of waveguides relative to the connector, wherein each ridge in the plurality of ridges is configured to contact a surface of a base portion of a polymer ribbon comprising the plurality of waveguides without a cladding layer.

2. The connector according to claim 1 , wherein the plurality of waveguides is formed in the polymer ribbon in a staggered position with respect to the plurality of ridges.

3. The connector according to claim 2 , wherein each of the plurality of ridges utilizes the surface that is without a cladding layer as a stopping surface, thereby positioning the polymer ribbon in a height direction along the transverse direction of the recessed portion.

4. The connector according to claim 2 , wherein the connector member further comprises at least one tapered ridge contacting a ridge formed in the polymer ribbon and positioning the polymer ribbon in a transverse direction.

5. The connector according to claim 4 , wherein each of the plurality of waveguides is an optical waveguide.

6. The connector according to claim 1 , further comprising:

a first aperture formed within a first wall of the recessed portion; and

a second aperture formed within a second wall of the recessed portion.

7. The connector according to claim 1 , wherein the polymer ribbon comprises positioning ridges and optical waveguides formed in the base portion.

8. The connector according to claim 7 , wherein a surface of the positioning ridges contacts a surface of the recessed portion.

9. The connector according to claim 1 , wherein the base portion is a cladding layer that is separate from a cladding layer surrounding each waveguide in the plurality of waveguides and extending from the base portion.

10. An electronic device comprising:

a connector comprising:

a connector member comprising a recessed portion to arrange a plurality of waveguides formed side-by-side in a transverse direction; and

a backup member arranged within the recessed portion interposing the plurality of waveguides between the connector member and the backup member, wherein

the recessed portion comprises a plurality of ridges arranged in a staggered pattern relative to the plurality of waveguides for positioning the plurality of waveguides relative to the connector, wherein each ridge in the plurality of ridges is configured to contact a surface of a base portion of a polymer ribbon comprising the plurality of waveguides without a cladding layer, and

a semiconductor device coupled to the connector.

11. The electronic device according to claim 10 , wherein the plurality of waveguides is formed in the polymer ribbon in a staggered position with respect to the plurality of ridges.

12. The electronic device according to claim 11 , wherein each of the plurality of ridges utilizes the surface that is without a cladding layer as a stopping surface, thereby positioning the polymer ribbon in a height direction along the transverse direction of the recessed portion.

13. The electronic device according to claim 11 , wherein the connector member further comprises at least one tapered ridge contacting a ridge formed in the polymer ribbon and positioning the polymer ribbon in a transverse direction.

14. The electronic device according to claim 13 , wherein each of the plurality of waveguides is an optical waveguide.

15. The electronic device according to claim 10 , further comprising:

a first aperture formed within a first wall of the recessed portion; and

a second aperture formed within a second wall of the recessed portion.

16. The electronic device according to claim 10 , wherein the polymer ribbon comprises positioning ridges and optical waveguides formed in the base portion.

17. The electronic device according to claim 10 , wherein the base portion is a cladding layer that is separate from a cladding layer surrounding each waveguide in the plurality of waveguides and extending from the base portion.

18. An alignment method for coupling optical signals to a semiconductor device, the method comprising:

arranging a connector member comprising a recessed portion to arrange a plurality of waveguides formed side-by-side in a transverse direction;

arranging the plurality of waveguides inside the recessed portion;

arranging a backup member within the recessed portion interposing the plurality of waveguides between the connector member and the backup member; and

supporting the plurality of waveguides with a plurality of ridges arranged in a staggered pattern relative to the plurality of waveguides by reducing a distance between the backup member and the connector member,

wherein the supporting situates each ridge in the plurality of ridges in contact with the surface of base portion of the polymer ribbon without a cladding layer.

19. The alignment method according to claim 18 , wherein the plurality of waveguides is formed in the polymer ribbon in a staggered position relative to the plurality of ridges, and wherein supporting the plurality of waveguides further comprises the inserting the plurality of ridges between the plurality of waveguides to reduce the distance between the backup member and the connector member.

20. The alignment method according to claim 18 , wherein each of the plurality of waveguides is an optical waveguide.