Multi-level air gap formation in dual-damascene structure
An upper layer is formed in a first interlayer dielectric (ILD) layer. The upper layer comprises a plurality of metal interconnects and one or more upper layer air gaps positioned between adjacent metal interconnects. A lower layer is formed in the first ILD layer. The lower layer comprises one or more vias, and one or more lower air gaps positioned between adjacent vias. The upper layer and the lower layer are formed in accordance with a dual-damascene process.
1. A semiconductor structure formed in accordance with a dual-damascene process comprising:
an upper layer formed in a first interlayer dielectric (ILD) layer, the upper layer comprising:
a plurality of metal interconnects; and
one or more upper layer air gaps positioned between adjacent metal interconnects; and
a lower layer formed in the first ILD layer, the lower layer comprising:
one or more vias; and
one or more lower layer air gaps positioned between adjacent vias, a second ILD layer; and
one or more components embedded in the second ILD layer, the one or more components comprising one or more contacts;
wherein the one or more vias are configured to place the plurality of metal interconnects in electrical communication with the one or more contacts.
2. The structure of claim 1 , wherein the one or more lower layer air gaps are formed within one or more respective dielectric regions.
3. The structure of claim 2 , wherein the one or more dielectric regions are comprised of a low-k dielectric material.
4. The structure of claim 1 , wherein the one or more components embedded in the second ILD layer further comprise:
one or more gate regions; and
one or more caps;
wherein each cap is positioned in physical contact with a respective gate region.
5. The structure of claim 4 , wherein the one or more components embedded in the second ILD layer further comprise one or more source/drain contact regions.
6. The structure of claim 1 , wherein the height of the air gaps is adjusted by conformal modulation.
7. A semiconductor structure formed in accordance with a dual-damascene process comprising:
an upper layer formed in a first interlayer dielectric (ILD) layer, the upper layer comprising:
a plurality of metal interconnects; and
one or more upper layer air gaps positioned between adjacent metal interconnects; and
a lower layer formed in the first ILD layer, the lower layer comprising:
one or more vias; and
one or more lower layer air gaps positioned between adjacent vias, wherein the one or more lower layer air gaps are formed within one or more respective dielectric regions;
a second ILD layer; and
one or more components embedded in the second ILD layer, the one or more components comprising one or more gate regions and one or more caps positioned in physical contact with a respective gate region;
wherein the one or more vias are configured to place the plurality of metal interconnects in electrical communication with the one or more components; and
wherein the one or more dielectric regions are positioned in physical contact with the one or more caps, respectively.
8. The structure of claim 7 , wherein the one or more dielectric regions are comprised of a low-k dielectric material.
9. The structure of claim 7 , wherein the one or more components embedded in the second ILD layer further comprise one or more contacts, and wherein the one or more vias are configured to place the plurality of metal interconnects in electrical communication with the one or more contacts.
10. The structure of claim 7 , wherein the one or more components embedded in the second ILD layer further comprise one or more source/drain contact regions.
11. The structure of claim 10 , wherein the one or more components embedded in the second ILD layer further comprise one or more barrier lines, wherein the barrier lines are configured to isolate the one or more source/drain contact regions from the one or more gate regions.
12. A semiconductor structure formed in accordance with a dual-damascene process comprising:
an upper layer formed in a first interlayer dielectric (ILD) layer, the upper layer comprising:
a plurality of metal interconnects; and
one or more upper layer air gaps positioned between adjacent metal interconnects; and
a lower layer formed in the first ILD layer, the lower layer comprising:
one or more vias; and
one or more lower layer air gaps positioned between adjacent vias;
a second ILD layer; and
one or more components embedded in the second ILD layer, the one or more components comprising:
one or more gate regions and one or more caps positioned in physical contact with a respective gate region;
one or more source/drain contact regions; and
one or more barrier lines configured to isolate the one or more source/drain contact regions from the one or more gate regions;
wherein the one or more vias are configured to place the plurality of metal interconnects in electrical communication with the one or more components.
13. The structure of claim 12 , wherein the one or more lower layer air gaps are formed within one or more respective dielectric regions.
14. The structure of claim 13 , wherein the one or more dielectric regions are comprised of a low-k dielectric material.
15. The structure of claim 12 , wherein the one or more components comprise one or more contacts, and wherein the one or more vias are configured to place the plurality of metal interconnects in electrical communication with the one or more contacts.
16. The structure of claim 12 , wherein the one or more dielectric regions are positioned in physical contact with the one or more caps, respectively.
17. An integrated circuit comprising:
an upper layer formed in a first interlayer dielectric (ILD) layer, the upper layer comprising:
a plurality of metal interconnects; and
one or more upper layer air gaps positioned between adjacent metal interconnects; and
a lower layer formed in the first ILD layer, the lower layer comprising:
one or more vias; and
one or more lower layer air gaps positioned between adjacent vias;
wherein the upper layer and the lower layer are formed in accordance with a dual-damascene process;
a second ILD layer; and
one or more components embedded in the second ILD layer, the one or more components comprising one or more contacts;
wherein the one or more vias are configured to place the plurality of metal interconnects in electrical communication with the one or more contacts.
18. The integrated circuit of claim 17 , wherein the height of the air gaps is adjusted by conformal modulation.
19. An integrated circuit comprising:
an upper layer formed in a first interlayer dielectric (ILD) layer, the upper layer comprising:
a plurality of metal interconnects; and
one or more upper layer air gaps positioned between adjacent metal interconnects; and
a lower layer formed in the first ILD layer, the lower layer comprising:
one or more vias; and
one or more lower layer air gaps positioned between adjacent vias, wherein the one or more lower layer air gaps are formed within one or more respective dielectric regions;
wherein the upper layer and the lower layer are formed in accordance with a dual-damascene process;
a second ILD layer; and
one or more components embedded in the second ILD layer, the one or more components comprising one or more gate regions and one or more caps positioned in physical contact with a respective gate region;
wherein the one or more vias are configured to place the plurality of metal interconnects in electrical communication with the one or more components; and
wherein the one or more dielectric regions are positioned in physical contact with the one or more caps, respectively.
20. An integrated circuit comprising:
an upper layer formed in a first interlayer dielectric (ILD) layer, the upper layer comprising:
a plurality of metal interconnects; and
one or more upper layer air gaps positioned between adjacent metal interconnects; and
a lower layer formed in the first ILD layer, the lower layer comprising:
one or more vias; and
one or more lower layer air gaps positioned between adjacent vias;
a second ILD layer; and
one or more components embedded in the second ILD layer, the one or more components comprising:
one or more gate regions and one or more caps positioned in physical contact with a respective gate region;
one or more source/drain contact regions; and
one or more barrier lines configured to isolate the one or more source/drain contact regions from the one or more gate regions;
wherein the one or more vias are configured to place the plurality of metal interconnects in electrical communication with the one or more components.