Implantable sensor enclosure with thin sidewalls
A wireless circuit includes a housing, such as a hermetic housing, and at least one antenna coil wound about a coil axis within the housing. The coil axis may be substantially parallel to at least one wall of the housing, wherein the wall parallel to the coil axis is substantially thinner than other walls of the housing.
1. A wireless circuit for an implant comprising:
a housing including side walls defining a cuboid wherein said housing has a length, width and height dimensions, and wherein the length is greater than the housing's width and height dimensions, and wherein two opposite sides of the housing are open;
at least one antenna coil wound about a coil axis and positioned within said housing;
thin walls bonded to the open sides of the housing wherein said coil axis is substantially parallel to the thin walls of said housing and perpendicular to said length of said housing;
wherein said thin walls are thinner than the side walls of said housing.
2. The wireless circuit of claim 1 , further comprising a pressure sensor that is configured to measure pressure.
3. The wireless circuit of claim 2 , wherein said thin walls are configured to deform in proportion to pressure exerted on the thin walls.
4. The wireless circuit of claim 1 , further comprising a battery.
5. The wireless circuit of claim 1 , wherein said thin walls further comprise a material selected from a group including: sapphire, fused silica, quartz, glass, ceramic, titanium, alumina, silicon, diamond, and polymer.
6. The wireless circuit of claim 1 , wherein said wireless circuit is created by forming a cavity in at least one part of said housing prior to bonding said thin walls to the open sides of the housing.
7. The wireless circuit of claim 1 , wherein said thin walls are modified by thinning at least a portion of said thin walls after the thin walls are bonded to the open sides of the housing.
8. The wireless circuit of claim 1 , wherein said thin walls are bonded to the open sides of the housing by a process selected from a group including: laser welding, glass frit bonding, laser frit welding, compression bonding, anodic bonding, eutectic bonding, brazing, or soldering.
9. The wireless circuit of claim 1 , further comprising an electronics portion, wherein the electronics portion serves as one of the thin walls bonded to the open sides of said housing.
10. The wireless circuit of claim 1 , further comprising a thin film electronics device.
11. The wireless circuit of claim 1 , further comprising an electronics portion and a chamber that contains said antenna coil, wherein the electronics portion is disposed in said housing separate from the chamber that contains said antenna coil.
12. The wireless circuit of claim 1 , wherein said housing bonded with said thin walls is filled with a substance selected from a group including: liquid, gel, vacuum, inert gas, or air.
13. The wireless circuit of claim 1 , wherein said thin walls of said housing have a thickness less than about 0.025 mm, about 0.020 mm, about 0.015 mm, about 0.010 mm, about 0.005 mm, about 0.001 mm and any sized thickness in between.
14. The wireless circuit of claim 1 , wherein the side walls of the housing are between about 0.3 mm to about 0.7 mm.