IP Library Granted Patent US 9,869,776
Granted Patent B2
US 9,869,776 · App. 15/518,576 · Granted Jan 16, 2018

Ray detector

Inventor: Feng Jiang (Beijing, CN)
Assignee: BOE TECHNOLOGY GROUP CO., LTD.
G01T1/2018A61B6/42G01T1/2002
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,869,776
App. No.
15/518,576
Granted
Jan 16, 2018
Kind
B2
Abstract

Embodiments of the disclosure provide a ray detector, which comprises a ray conversion layer for converting a ray incident on the ray detector into visible light, a photoelectric conversion layer for receiving the visible light and converting it into a charge signal, a pixel array having a plurality of pixels for detecting the charge signal, and a substrate below the photoelectric conversion layer, at least for directly or indirectly carrying the photoelectric conversion layer. The photoelectric conversion layer is made from a two-dimensional semiconductor material. Due to the high carrier mobility of the two-dimensional semiconductor material, it is possible to enable the external signal processing system to detect the charge signal more easily, so that a ray source with low energy can be used for ray detection. Therefore, a ray detector with high sensitivity can be provided, which may reduce the usage cost and be advantageous to saving energy.

Claims (23)

1. A method of manufacturing a photoelectric conversion layer capable of receiving visible light and converting the visible light into a charge signal, wherein the method comprises:

sprinkling powders of a two-dimensional semiconductor material uniformly on a friction substrate;

rubbing the friction substrate using a first flexible board to obtain a friction substrate attached with the two-dimensional semiconductor material;

rubbing the friction substrate attached with the two-dimensional semiconductor material against a target substrate to form the photoelectric conversion layer on the target substrate.

2. The method according to claim 1 , wherein the method further comprises rubbing the friction substrate attached with the two-dimensional semiconductor material using a second flexible board after rubbing the friction substrate with the first flexible board.

3. The method according to claim 2 , the friction substrate comprising an abrasive paper or a polishing disc.

4. A method of manufacturing a ray detector, wherein the method comprises:

forming, above a substrate, a pixel array comprising a plurality of pixels and a photoelectric conversion layer;

forming a ray conversion layer for converting a ray incident on the ray detector into visible light;

wherein the photoelectric conversion layer is used for receiving the visible light and converting the visible light into a charge signal,

and wherein forming the photoelectric conversion layer comprises the steps of:

sprinkling powders of a two-dimensional semiconductor material uniformly on a friction substrate;

rubbing the friction substrate using a first flexible board to obtain a friction substrate attached with the two-dimensional semiconductor material;

rubbing the friction substrate attached with the two-dimensional semiconductor material against a target substrate to form the photoelectric conversion layer on the target substrate.

5. The method of manufacturing a ray detector according to claim 4 , wherein the substrate is a flexible substrate.

6. The method of manufacturing a ray detector according to claim 5 , wherein the target substrate is a flexible substrate on which the pixel array has been formed, the photoelectric conversion layer and the ray conversion layer being formed successively over the pixel array.

7. The method of manufacturing a ray detector according to claim 6 , wherein a step of forming the pixel array comprises: manufacturing a common electrode and a pixel electrode corresponding to each pixel, the common electrode and the pixel electrode being in contact with the photoelectric conversion layer.

8. The method of manufacturing a ray detector according to claim 7 , wherein the method further comprises manufacturing a first intermediate layer on the photoelectric conversion layer after forming the photoelectric conversion layer, the first intermediate layer comprising a light blocking matrix and a passivation layer.

9. The method of manufacturing a ray detector according to claim 5 , wherein the target substrate is the flexible substrate, the photoelectric conversion layer and the pixel array being formed successively on the flexible substrate, the ray conversion layer being formed below the flexible substrate.

10. The method of manufacturing a ray detector according to claim 9 , wherein the step of forming the pixel array comprises manufacturing a common electrode and a pixel electrode corresponding to each pixel on the formed photoelectric conversion layer.

11. The method of manufacturing a ray detector according to claim 10 , wherein the method further comprises forming a third intermediate layer for protecting the photoelectric conversion layer after forming the pixel electrode and the common electrode, each pixel electrode being electrically connected to a source or a drain of a pixel switch in each pixel through a via hole in the third intermediate layer.

12. The method of manufacturing a ray detector according to claim 11 , wherein the method further comprises steps of:

forming a second intermediate layer below the flexible substrate prior to manufacturing the ray conversion layer, the second intermediate layer comprising a light blocking matrix.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2017
From: JIANG, FENG
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 042008/0068 →
Priority Claims (1)
CN 2015 1 0498841 · Aug 14, 2015 · national
Continuity (1)
Related Publication 20170285185A1 · Oct 5, 2017