Measuring device and component with measuring device integrated therein
The invention relates to a measuring device for measuring mechanical stresses or vibrations occurring in a component, wherein the measuring device comprises at least one electromechanical transducer, which can be integrated in a force-locked manner into the component, and at least one electronic unit, which is connected to the transducer via signal lines and is used to record and process the signals delivered by the transducer. In order to improve the robustness of the arrangement, it is provided according to the invention that the electronic unit is at least partially surrounded by a housing, and wherein a compensation zone for absorbing relative movements between the housing and the electronic unit is provided between the housing and the electronic unit.
1. A measuring device for measuring mechanical stresses or vibrations, comprising:
a housing;
at least one electromechanical transducer; and
at least one electronic unit, which is connected to the transducer via signal lines and is used to record and process signals delivered by the transducer,
wherein the electronic unit is at least partially surrounded by the housing, and a compensation zone for absorbing relative movements between the housing and the electronic unit is provided between the electronic unit and the housing, and
the transducer and the signal lines are integrated in a flexible plate, made from a fiber-reinforced polymer and having a linearly elastic behavior, the flexible plate extending from the housing, and being directly connected to the housing in a force-locked and material-locked manner, and therefore the housing and the transducer form substantially a single piece element with respect to propagation of vibrations.
2. The measuring device according to claim 1 , wherein the compensation zone is formed by a layer made from a first elastic material.
3. The measuring device according to claim 2 , wherein the first elastic material is a material having a first modulus of elasticity in a range of 0.001 to 10 GPa and/or non-linear elastic behavior.
4. The measuring device according to claim 2 , wherein the layer is produced by casting around the electronic unit.
5. The measuring device according to claim 2 , wherein the first elastic material is made from one of following materials: PP, TPU, PA, PPS, epoxide, LCP, TPI, PAI, PPS, PPSU, PEK, PEEK, phenol, PE, silicone, rubber, and polymer foam.
6. The measuring device according to claim 1 , wherein the compensation zone is a gap surrounding the electronic unit.
7. The measuring device according to claim 3 , wherein the housing is made from a second elastic material.
8. The measuring device according to claim 7 , wherein the second elastic material is a material having largely linear elastic behavior.
9. The measuring device according to claim 7 , wherein the second elastic material is made from one of following materials: epoxide, PA, phenol, PE, PU, PP, TPU, LCP, TPI, PAI, PA, PPS, PPSU, PI, PEK, and PEEK.
10. The measuring device according to claim 7 , wherein the first modulus of elasticity of the first elastic material is less than a second modulus of elasticity of the second elastic material.
11. The measuring device according to claim 1 , wherein the transducer comprises at least one piezoelectric transducer.
12. The measuring device according to claim 1 , wherein the flexible plate is at least partially surrounded by the housing.
13. The measuring device according to claim 8 , wherein the first material and/or the second material are made from a fiber-reinforced polymer.
14. The measuring device according to claim 1 , wherein the electronic unit is mounted onto the flexible plate with a printed circuit board having plated through-holes disposed therebetween, and is electrically connected to the signal lines.
15. The measuring device according to claim 1 , wherein the electronic unit comprises at least one of following components: passive components, plugs/sockets, clip contacts, solder contacts, cables, operational amplifiers, transponders, data memories, energy accumulators, frequency filters, A/D converters, radio module, peak detector, RFID module, antenna, shield, temperature sensor, and MEMS.
16. A component comprising the measuring device according to claim 1 at least partially integrated therein, wherein the component is made from a fiber composite material and the housing is at least partially directly connected to the component in a force-locked and material-locked manner.
17. The measuring device according to claim 1 , further comprising a printed circuit board on which the electronic unit is mounted, and partially integrated in the flexible plate to electrically connect the electronic unit and the transducer through the signal lines,
wherein the compensation zone surrounds the flexible plate in the housing to entirely cover the electronic unit and a portion of the printed circuit board not integrated in the flexible plate.