Coil unit for thin film inductor, method of manufacturing coil unit for thin film inductor, thin film inductor, and method of manufacturing thin film inductor
A coil unit for a thin film inductor includes an insulating material having double insulating layers of a first and a second insulating layers; and a plurality of coil patterns formed to be embedded in the insulating material. At least one coil pattern among the coil patterns has a thickness different from a thickness of rest of the coil patterns.
1. A coil unit for a thin film inductor comprising:
an insulating material having double insulating layers of a first and a second insulating layers; and
a plurality of coil patterns formed to be embedded in the insulating material,
wherein the plurality of coil patterns comprise:
a coil pattern penetrating the first insulating layer and the second insulating layer and having a thickness corresponding to a thickness of the double insulating layers; and
a coil pattern embedded in the first insulating layer or the second insulating layer and having a thickness less than a thickness of the first or second insulation layer having the coil pattern embedded therein.
2. The coil unit for a thin film inductor according to claim 1 , wherein the coil patterns include:
a first plating layer formed to be embedded in the first insulating layer; and
a second plating layer formed to be embedded in the second insulating layer.
3. The coil unit for a thin film inductor according to claim 2 , wherein the first and the second insulating layers are photosensitive insulating layers.
4. The coil unit for a thin film inductor according to claim 3 , wherein the first insulating layer is formed of a mixture of prepreg and a resin, and the second insulating layer is formed of a resin.
5. The coil unit for a thin film inductor according to claim 3 , wherein the first insulating layer is formed of a resin, and the second insulating layer is formed of a mixture of prepreg and a resin.
6. The coil unit for a thin film inductor according to claim 2 , wherein at least one of the first and the second plating layers is formed of a plurality of plating layers.
7. The coil unit for a thin film inductor according to claim 1 , further comprising insulating resist formed on an upper surface and a lower surface of the insulating material.
8. The coil unit for a thin film inductor according to claim 2 , further comprising insulating resist formed on a portion of the first plating layer exposed to a lower surface of the first insulating layer and a portion of the second plating layer exposed to an upper surface of the second insulating layer.
9. A thin film inductor comprising:
the coil unit for a thin film inductor according to claim 1 ; and
a magnetic body joined to at least one of an upper surface or a lower surface of the coil unit for a thin film inductor.