Composite seal

1. A semiconductor manufacturing equipment including a composite seal, a first device in which a substrate is arranged and a plate-like second device arranged to face the first device to allow passage of ultraviolet rays, the composite seal being arranged so as to surround a periphery of the substrate and held between the first device and the second device to be elastically deformed to hermetically separate a space on one surface side of the second device from a space on an other side surface, the composite seal comprising:

a metal member arranged on a side of the composite seal facing the second device; and

an elastic member arranged on a side of the composite seal facing the first device and capable of elastic deformation,

wherein the metal member is in a flat, plate-like shape, and the elastic member includes a main body and a flange portion above the main body and extending outward from the main body, the main body is at least partially disposed in a groove in the first device and the flange portion is outside of said groove when the composite seal is compressed between the first and second devices,

wherein the metal member is provided so as to cover a region on an opposite side to the main body with the flange portion interposed therebetween,

wherein an end surface of the flange portion is a slope that has an outermost side located on a side facing the second device and is inclined inward from the side facing the second device toward a side facing the first device, and

wherein the metal member is on top of the flange portion, is outside of the groove, and significantly suppresses ultraviolet radiation from reaching the elastic member, thereby retarding degradation of the elastic member by ultraviolet rays.

2. The semiconductor manufacturing equipment according to claim 1 , wherein the main body has an approximately trapezoidal shape in cross section with a short side on a side facing the first device and a long side on a side facing the second device.

3. The semiconductor manufacturing equipment according to claim 1 , wherein the main body has a curved shape in cross section that protrudes toward the first device.

4. The semiconductor manufacturing equipment according to claim 1 , wherein

the elastic member is a rubber-like member, and

the metal member is a thin-film aluminum member.

5. The semiconductor manufacturing equipment according to claim 1 , wherein

the first device includes a groove provided so as to surround a periphery of a substrate arrangement region in which the substrate is arranged, and

the composite seal has an annular form and is accommodated in the groove.