Mask blank substrate, substrate with multilayer reflection film, transmissive mask blank, reflective mask blank, transmissive mask, reflective mask, and semiconductor device fabrication method
Disclosed is a mask blank substrate for use in lithography, wherein a main surface of the substrate satisfies a relational equation of (BA 70 −BA 30 )/(BD 70 −BD 30 )≧350 (%/nm), and has a maximum height (Rmax)≦1.2 nm in a relation between a bearing area (%) and a bearing depth (nm) obtained by measuring, with an atomic force microscope, an area of 1 μm×1 μm in the main surface on the side of the substrate where a transfer pattern is formed, wherein BA 30 is defined as a bearing area of 30%, BA 70 is defined as a bearing area of 70%, and BD 70 and BD 30 are defined to respectively represent bearing depths for the bearing area of 30% and the bearing area of 70%.
1. A transmissive mask blank having a light shielding function film on a main surface of a mask blank substrate, the light shielding function film serving as a transfer pattern, wherein
a surface of the light shielding function film satisfies a relational equation of (BA 70 −BA 30 )/(BD 70 −BD 30 )≧350 (%/nm), and has a maximum height (Rmax)≦1.2 nm in a relation between a bearing area (%) and a bearing depth (nm) obtained by measuring, with an atomic force microscope, an area of 1 μm×1 μm in the surface of the light shielding function film, where BA 30 is defined as a bearing area of 30%, BA 70 is defined as a bearing area of 70%, and BD 70 and BD 30 are respectively defined as bearing depths for the bearing area of 30% and the bearing area of 70%.
2. The transmissive mask blank according to claim 1 , wherein the main surface of the mask blank substrate is such that, in a frequency distribution plotting a relation between the bearing depth, measured with the atomic force microscope, and a frequency (%) of the obtained bearing depth, the absolute value of the bearing depth corresponding to the center of a half-value width obtained from an approximation curve obtained by the plotted points or the highest frequency at the plotted points is smaller than the absolute value of the bearing depth corresponding to ½ of a maximum height (Rmax) of the surface roughness of the main surface.
3. The transmissive mask blank according to claim 1 , wherein the transmissive mask blank is a binary mask blank having a light shielding film for shielding exposure light formed on the mask blank substrate.
4. The transmissive mask blank according to claim 1 , wherein the transmissive mask blank is a phase shift mask blank having a phase shift film for changing a phase difference of exposure light formed on the mask blank substrate.
5. The transmissive mask blank according to claim 4 , wherein the phase shift mask blank has a light shielding film for shielding exposure light formed on the phase shift film.
6. The transmissive mask blank according to claim 1 , wherein the transmissive mask blank is a resist-film formed transmissive mask blank having a resist film formed thereon, the resist film serving as a mask for patterning the light shielding function film.
7. A transmissive mask having a light shielding function film pattern formed on the main surface by patterning the light shielding function film in the transmissive mask blank according to claim 1 .
8. A method of manufacturing a semiconductor device, comprising a step of forming a transfer pattern on a transferred substrate by performing a lithography process with an exposure device using the transmissive mask according to claim 7 .