Flex-less multilayer ceramic substrate

1. A flex-less optoelectronic assembly comprising:

a multilayer ceramic substrate that includes a plurality of ceramic layers and a via disposed through the plurality of ceramic layers, the via extending between a first surface of the multilayer ceramic substrate and a second surface of the multilayer ceramic substrate, the second surface of the multilayer ceramic substrate being oppositely positioned with respect to the first surface of the multilayer ceramic substrate;

a module board coupled to the first surface of the multilayer ceramic substrate, the module board including a through hole that is substantially aligned with the via;

an electronic component physically coupled to the second surface of the multilayer ceramic substrate, the via electrically coupling the electronic component and the module board and

a heat sink physically coupled to the second surface of the multilayer ceramic substrate, the heat sink being configured to dissipate heat emitted by the electronic component.

2. The flex-less optoelectronic assembly of claim 1 , wherein the electronic component is configured to simultaneously transmit and receive data over multiple optical fibers.

3. The flex-less optoelectronic assembly of claim 1 , wherein the multilayer ceramic substrate is configured to dissipate heat emitted by the electronic component.

4. The flex-less optoelectronic assembly of claim 1 , wherein the heat sink is at least partially integrated with the multilayer ceramic substrate.

5. The flex-less optoelectronic assembly of claim 4 , wherein the heat sink comprises an interstitial heat sink component that is disposed between at least two areas of the multilayer ceramic substrate.

6. The flex-less optoelectronic assembly of claim 1 , wherein at least one surface of the heat sink is brazed to the multilayer ceramic substrate.

7. The flex-less optoelectronic assembly of claim 1 , wherein the heat sink comprises a first material with a first coefficient of thermal expansion, and wherein the multilayer ceramic substrate comprises a second material with a second coefficient of thermal expansion.

8. The flex-less optoelectronic assembly of claim 7 , wherein the first coefficient of thermal expansion is within ten times the second coefficient of thermal expansion.

9. The flex-less optoelectronic assembly of claim 8 , wherein the multilayer ceramic substrate comprises a second material with a second coefficient of thermal expansion, wherein the module board comprises a third material with a third coefficient of thermal expansion, wherein the third coefficient of thermal expansion is within ten times the second coefficient of thermal expansion.

10. An optoelectronic assembly comprising:

a multilayer ceramic substrate that comprises:

a plurality of ceramic layers and a first via disposed through at least one of the plurality of ceramic layers, the first via being formed from a conductive material that is configured to communicate a signal through the first via;

a first mount point configured to receive a first electronic component and to couple the first electronic component on a surface of the multilayer ceramic substrate, the first mount point including at least a portion of the first via;

a second mount point configured to receive a second electronic component on the surface of the multilayer ceramic substrate, the second mount point including at least a portion of a second via; and

a heat sink physically coupled to the surface of the multilayer ceramic substrate, the heat sink being configured to dissipate heat emitted by the first electronic component and the second electronic component, wherein the heat sink is at least partially integrated with the multilayer ceramic substrate.

11. The optoelectronic assembly of claim 10 , further comprising the first electronic component, wherein the first electronic component is configured to simultaneously transmit and receive data over multiple optical fibers.

12. The optoelectronic assembly of claim 10 , wherein the first via is a blind via and is coupled to the second via by a conductor.

13. The optoelectronic assembly of claim 10 , wherein the multilayer ceramic substrate is configured to dissipate heat emitted by the first electronic component and the second electronic component.

14. The optoelectronic assembly of claim 10 , wherein at least one surface of the heat sink is brazed to the multilayer ceramic substrate.

15. The optoelectronic assembly of claim 10 , wherein the heat sink comprises a first material with a first coefficient of thermal expansion, wherein the multilayer ceramic substrate comprises a second material with a second coefficient of thermal expansion.

16. The optoelectronic assembly of claim 15 , wherein the first coefficient of thermal expansion is within ten times the second coefficient of thermal expansion.

17. The optoelectronic assembly of claim 10 further comprising a module board, wherein the multilayer ceramic substrate of a second material with a second coefficient of thermal expansion, wherein the module board is composed of a third material with a third coefficient of thermal expansion, wherein the third coefficient of thermal expansion is a number within ten times the second coefficient of thermal expansion.