Floor panel for an aircraft, and an aircraft comprising such a floor panel
A floor panel for an aircraft comprising a panel structure for transmitting forces applied to the floor panel, wherein the panel structure includes an upper cover layer, a lower cover layer, and a core assembly sandwiched between the upper and lower cover layers, and a heater layer for heating the floor panel, wherein the heater layer is provided between the upper and lower cover layers. The object of the present disclosure, to provide a possibly simple heated floor panel for an aircraft, wherein the risk of overheating and at the same time the risk of local hot spots at the heater layer is reduced, is achieved in that the heater layer is formed as a PTC-layer having a plurality of electric conductor paths interconnected to one another by a plurality of PTC-resistor paths comprising a PTC-material, wherein the electric resistance of the PTC-Material increases with increasing temperature.
1. A floor panel for an aircraft, the floor panel comprising:
a panel structure for transmitting forces applied to the floor panel, wherein the panel structure comprises an upper cover layer, a lower cover layer, and a core assembly sandwiched between the upper and lower cover layers; and
a heater layer for heating the floor panel,
wherein the heater layer is formed as a PTC-layer having a plurality of electric conductor paths interconnected to one another by one or more PTC-resistor paths comprising a PTC-material, wherein the electric resistance of the PTC-Material increases with increasing temperature,
wherein the core assembly comprises an upper core portion and a lower core portion, and
wherein the heater layer is provided between the upper core portion and the lower core portion, or the heater layer is provided attached to or inside the lower cover layer.
2. The floor panel according to claim 1 , wherein an upper additional layer is provided between the heater layer and the upper core portion.
3. The floor panel according to claim 2 , wherein the upper additional layer is formed of a glass fiber reinforced plastic material or of an aramid fiber material.
4. The floor panel according to claim 1 , wherein a lower additional layer is provided between the heater layer and the lower core portion.
5. The floor panel according to claim 4 , wherein the lower additional layer is formed of a glass fiber reinforced plastic material or of an aramid fiber material.
6. The floor panel according to claim 1 , wherein the upper cover layer is formed of a carbon fiber reinforced plastic material, a glass fiber reinforced plastic material, an aramid fiber material, a metal material, or a combination thereof.
7. The floor panel according to claim 1 , wherein the lower cover layer is formed of a carbon fiber reinforced plastic material, a glass fiber reinforced plastic material, an aramid fiber material, a metal material, or a combination thereof.
8. The floor panel according to claim 1 , wherein the core assembly comprises a honeycomb structure or a foam material.
9. The floor panel according to claim 1 , wherein the conductor paths extend in parallel to one another, and wherein the PTC-resistor paths extend in parallel to one another and transverse to the conductor paths, so that each PTC-resistor path connects two adjacent conductor paths.
10. The floor panel according to claim 9 , wherein the distance between two adjacent conductor paths, the cross section of the PTC-resistor paths, and the density of the PTC-material are configured such that for a desired operational current at a fixed ambient temperature a desired carpet temperature at the upper cover layer is reached.
11. The floor panel according to claim 1 , wherein a current supply and a control unit are provided, wherein the control unit is configured to control a current flowing through the conductor paths in dependence of an ambient temperature, such that when the current flowing through the conductor path is higher than a predetermined threshold current which corresponds to a defined maximum carpet temperature at the upper cover layer and which depends on the ambient temperature, the current supply is switched on, wherein when the current flowing through the conductor paths is lower than the predetermined threshold current, the current supply is switched off.
12. The floor panel according to claim 1 , wherein a GFCI-device is provided and connected to the conductor paths.
13. The floor panel according to claim 1 , wherein the floor panel comprises a temperature sensor.
14. An aircraft comprising a floor panel according to claim 1 .
15. The aircraft according to claim 14 , wherein the floor panel is arranged in a door area next to a door of a cabin of the aircraft.