Laser ablation and processing methods and systems
Systems and methods for ablating or processing a surface using a laser beam are provided. A method includes directing a laser beam at a surface to form a contact area. The method also includes moving the contact area to form a contact curve. The method includes tuning a wavelength and a power of the laser beam to process a material and/or ablate a coating. The wavelength and the power may be further tuned to not damage the surface beneath the coating. Moving the contact area may include forming a second contact curve by superimposing, at a same time, the second contact curve on the contact curve. A system includes a laser and a directing arrangement configured to direct a laser beam from the laser at a surface to form a contact area. A non-transitory processor-readable medium having instructions stored thereon is provided.
1. A method, comprising:
directing a laser beam at a surface to form a contact area; and
rotationally moving the contact area to form a contact curve that comprises an arcuate pattern.
2. The method of claim 1 , further comprising tuning parameters of the laser beam, the parameters comprising at least one of a wavelength, a pulse duration, and a power.
3. The method of claim 2 , wherein:
the parameters are tuned to ablate a coating, the coating being at least one of corrosion, foreign material, soiling and paint; and
the parameters are tuned to not damage the surface beneath the coating.
4. The method of claim 2 , wherein the parameters are tuned to process the surface, the processing being at least one of material processing, surface texturing, laser annealing, laser hardening, laser welding and laser skin treatments.
5. The method of claim 1 , wherein moving the contact area further comprises forming a second contact curve by superimposing, at a same time, the second contact curve on the contact curve.
6. The method of claim 5 , wherein:
the contact curve is a contact circle having a diameter; and
the second contact curve is a second contact circle having a second diameter.
7. The method of claim 6 , wherein:
the second diameter is less than the diameter; and
the second diameter is equal to or greater than one half of the diameter.
8. The method of claim 5 , wherein moving the contact area further comprises forming a third contact curve by superimposing, at the same time, the third contact curve on the second contact curve and the contact curve.
9. The method of claim 8 , wherein:
the contact curve is a contact circle having a diameter;
the second contact curve is a second contact circle having a second diameter; and
the third contact curve is a third contact circle having a third diameter.
10. The method of claim 9 , wherein:
the second and third diameters are less than the diameter;
the second diameter is equal to or greater than one half of the diameter; and
the third diameter is equal to or greater than one half of the second diameter.
11. The method of claim 1 , wherein the contact area is rotationally moved by reflecting the laser beam off a mirror rotating around an axis, the axis extending through a plane of the mirror, the axis being at an angle other than 90 degrees, so that the angle of incidence of the laser beam on the mirror varies through a single rotation of the mirror.
12. The method of claim 1 , wherein the contact area is moved at a substantially constant rate to avoid hot spots and to provide substantially equal fluence of photons of the laser beam on the surface.
13. The method of claim 1 , wherein:
the contact area is formed by the laser beam impacting the surface at an impact angle; and
the impact angle is less than or equal to 90 degrees.
14. The method of claim 13 , wherein the impact angle is adjustable to provide exposure to irregular parts of the surface when the surface has local areas not parallel to the surface.
15. The method of claim 13 , wherein:
the contact curve is a closed curve; and
the impact angle varies as a function of time during a single rotation of the laser beam through the closed curve.
16. The method of claim 1 , wherein the contact area is moved in a first circular direction to form the contact curve.
17. The method of claim 16 , wherein the contact area is moved in a second circular direction superimposed on the first circular direction to form the contact curve.
18. The method of claim 17 , wherein:
the first circular direction defines a first circle;
the second circular direction defines a second circle; and
the first circle has a radius less than or equal to a diameter of the second circle.
19. The method of claim 17 , wherein:
the first circular direction defines a first oval; and
the second circular direction defines a second oval.
20. A system, comprising:
a laser;
a directing arrangement configured to direct a laser beam from the laser at a surface to form a contact area and rotationally move the contact area to form a contact curve; and
forming a second contact curve by superimposing, at a same time, the second contact curve on the contact curve, the second contact curve having a different diameter than a diameter of the contact curve.
21. A non-transitory processor-readable medium having instructions stored thereon, which when executed by one or more processors, cause the one or more processors to implement a method comprising:
directing a laser beam at a surface to form a contact area;
moving the contact area to form a contact curve; and
forming a second contact curve by superimposing, at a same time, the second contact curve on the contact curve, the second contact curve having a different diameter than a diameter of the contact curve.