IP Library Granted Patent US 9,932,439
Granted Patent B2
US 9,932,439 · App. 15/023,174 · Granted Apr 3, 2018

Photosensitive resin composition and cured article of same, and optical component

Inventors: Tamaki Son (Ohtake, JP); Takashi Kubo (Tokyo, JP)
Assignee: DAICEL CORPORATION
C08G59/687C08G59/24C08K3/04C08L63/00C09D5/00C09D163/00C09D163/08C09J163/00G02B1/00G02B1/04G02B5/003
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Quick Facts
Patent No.
US 9,932,439
App. No.
15/023,174
Granted
Apr 3, 2018
Kind
B2
Abstract

Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness. The present invention relates to a photosensitive resin composition that includes components as follows: (A) a cationically polymerizable compound at least including a compound containing an alicyclic epoxy group and devoid of ester bonds; (B) a photo-cationic polymerization initiator including a cationic moiety and an anionic moiety containing a boron atom; and (C) a light-shielding material.

Claims (31)

1. A photosensitive resin composition comprising components as follows:

(A) a cationically polymerizable compound at least comprising a compound containing an alicyclic epoxy group and devoid of ester bonds;

(B) a photo-cationic polymerization initiator including a cationic moiety and an anionic moiety containing a boron atom;

(C) a light-shielding material; and

(D) a hydroxyl-containing compound having a molecular weight of 500 or more, wherein the component (D) comprises at least one of a hydroxyl-containing compound having a polycarbonate skeleton in the molecule, a hydroxyl-containing compound having a polyester skeleton in the molecule, or a hydroxyl-containing compound having a polydiene skeleton in the molecule.

2. The photosensitive resin composition according to claim 1 , wherein the compound containing an alicyclic epoxy group and devoid of ester bonds in the component (A) is a compound represented by Formula (a-1):

wherein R 1 to R 18 are identical or different and are independently selected from the group consisting of a hydrogen atom, a halogen atom, a hydrocarbon group optionally containing at least one of oxygen and halogen, and an optionally substituted alkoxy group; and X is selected from a single bond and a linkage group, excluding ester-bond-containing linkage groups.

3. The photosensitive resin composition according to claim 2 , wherein the anionic moiety of the component (B) is an anion represented by Formula (1):

[Chem. 2]

[(R) n BF 4−n ] −   (1)

wherein R represents a monovalent hydrocarbon group or a monovalent fluorinated hydrocarbon group; and n represents an integer from 1 to 4.

4. The photosensitive resin composition according to claim 2 , wherein the anionic moiety of the component (B) is an anion represented by Formula (2):

wherein X1 to X4 are identical or different, each represent an integer from 0 to 5, and the total of all of X1 to X4 is one or more.

5. The photosensitive resin composition according to claim 2 , wherein the component (C) is a carbon black.

6. A cured product of the photosensitive resin composition according to claim 2 .

7. The photosensitive resin composition according to claim 1 , wherein the anionic moiety of the component (B) is an anion represented by Formula (1):

[Chem. 2]

[(R) n BF 4−n ] −   (1)

wherein R represents a monovalent hydrocarbon group or a monovalent fluorinated hydrocarbon group; and n represents an integer from 1 to 4.

8. The photosensitive resin composition according to claim 7 , wherein the anionic moiety of the component (B) is an anion represented by Formula (2):

wherein X1 to X4 are identical or different, each represent an integer from 0 to 5, and the total of all of X1 to X4 is one or more.

9. The photosensitive resin composition according to claim 7 , wherein the component (C) is a carbon black.

10. A cured product of the photosensitive resin composition according to claim 7 .

11. The photosensitive resin composition according to claim 1 , wherein the anionic moiety of the component (B) is an anion represented by Formula (2):

wherein X1 to X4 are identical or different, each represent an integer from 0 to 5, and the total of all of X1 to X4 is one or more.

12. The photosensitive resin composition according to claim 11 , wherein the component (C) is a carbon black.

13. A cured product of the photosensitive resin composition according to claim 11 .

14. The photosensitive resin composition according to claim 1 , wherein the component (C) is a carbon black.

15. A cured product of the photosensitive resin composition according to claim 14 .

16. A cured product of the photosensitive resin composition according to claim 1 .

17. An optical component comprising the cured product according to claim 16 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 13, 2016
From: SON, TAMAKI; KUBO, TAKASHI
To: DAICEL CORPORATION
Reel/Frame 038893/0199 →
Priority Claims (1)
JP 2013-192855 · Sep 18, 2013 · national
Continuity (1)
Related Publication 20160289370A1 · Oct 6, 2016