Semiconductor device
A highly reliable semiconductor device capable of heavy current conduction and high temperature operation has a module structure in which a semiconductor chip and a circuit pattern are electrically connected via a wire. A front surface metal film is formed on a front surface electrode of the chip, and the wire is bonded to the front surface metal film by wire bonding. The chip has a front surface electrode on the front surface of an Si substrate or an SiC substrate, and has a rear surface substrate on the rear surface thereof. The front surface metal film is a Ni film or a Ni alloy film of having a thickness ranging from 3 μm to 7 μm. The wire is an Al wire having an increased recrystallizing temperature and improved strength due to controlling the crystal grain sizes before wire bonding to a range of 1 μm to 20 μm.
1. A semiconductor device having a module structure including a circuit pattern and a semiconductor element disposed on the circuit pattern that are electrically connected to one another with a wire, comprising:
a conducting unit that is disposed on a surface of the semiconductor element; and
a metal film that is comprised of a metal having nickel as a main component, that is disposed on a surface of the conducting unit and to which one end of said wire is ultrasonically bonded using ultrasonic vibration, that has a degree of hardness that is greater than that of the conducting unit, and that has a thickness ranging from 3 μm to 7 μm,
wherein said wire is comprised of an aluminum alloy containing aluminum as the main component with a purity of 99.99 percent or more, and iron present in a range of 0.2 mass percent to 2.0 mass percent,
wherein the wire has a wire diameter ranging from 500 μm up to but less than 600 μm, and is comprised of a wire area near a bonded interface between the wire and the metal film and a wire area excluding the wire area near the bonded interface after wire bonding,
wherein the wire area near the bonded interface has a crystal grain size that ranges between 1 μm to 15 μm, the wire area excluding the wire area near the bonded interface has a crystal grain size that ranges between 1 μm to 20 μm, and the crystal grain size of the wire area near the bonded interface is finer than the crystal grain size of the wire area excluding the wire area near the bonded interface, and
wherein the bonded interface between the wire and the metal film has a bond strength for dissimilar metals that is equivalent to that for similar metals.
2. The semiconductor device according to claim 1 , wherein the semiconductor element includes a semiconductor substrate selected from a silicon substrate comprised of silicon and a silicon carbide substrate comprised of silicon carbide, and wherein the conducting unit is comprised of aluminum as a major component and is disposed on the surface of the semiconductor substrate.
3. The semiconductor device according to claim 1 , wherein the metal film is a nickel alloy film comprising nickel as a main component and at least one of phosphorus and boron.
4. A semiconductor device having a module structure including a circuit pattern comprised of copper and a semiconductor element disposed on the circuit pattern that are electrically connected to one another with a wire, comprising:
a front surface electrode disposed on a front surface of the semiconductor element; and
a front surface metal film that is disposed on a front surface of the front surface electrode, that is comprised of a metal having nickel as a main component, that has a degree of hardness that is greater than that of the front surface electrode, that has a thickness ranging from 3 μm to 7 μm, and to which one end of the wire is ultrasonically bonded using ultrasonic vibration;
wherein said wire is comprised of an aluminum alloy having aluminum as a main component with the aluminum having a purity of 99.99 percent or more, and containing iron present in a range of 0.2 mass percent to 2.0 mass percent, and has a wire diameter ranging from 500 μm up to but less than 600 μm, and
wherein the one end of the wire and the metal film has a bonded interface that has a bond strength for dissimilar metals that is at least equivalent to that for similar metals.
5. The semiconductor device according to claim 4 , wherein the wire is comprised of a wire area near the bonded interface between the wire and the front surface metal film and a wire area excluding the wire area near the bonded interface after wire bonding, and wherein the wire area near the bonded interface has a crystal grain size that ranges between 1 μm to 15 μm, the wire area excluding the wire area near the bonded interface has a crystal grain size that ranges between 1 μm to 20 μm, and the crystal grain size of the wire area near the bonded interface is finer than the crystal grain size of the wire area excluding the wire area near the bonded interface.
6. The semiconductor device according to claim 4 , wherein the semiconductor element includes a semiconductor substrate selected from a silicon substrate comprised of silicon and a silicon carbide substrate comprised of silicon carbide, and the front surface electrode is comprised of aluminum as a major component.
7. The semiconductor device according to claim 6 , wherein the front surface metal film is comprised of a nickel alloy having nickel as a main component and containing at least one of phosphorus and boron.