Light-emitting diode and display device manufactured from the light-emitting diode
A light-emitting diode is provided. The light-emitting diode includes a first semiconductor structure having an upper surface and a lower surface; a second semiconductor layer disposed adjacent to the upper surface; a third semiconductor layer disposed adjacent to the lower surface; two light-emitting layers disposed between the upper surface and the second semiconductor layer and disposed between the lower surface and the third semiconductor layer, respectively; a first electrode disposed over the second semiconductor layer; and a second electrode disposed over the third semiconductor layer.
1. A display device, comprising:
a thin film transistor substrate, wherein the thin film transistor substrate comprises:
a substrate;
a thin film transistor disposed over the substrate;
a common electrode disposed over the substrate; and
a light-emitting diode disposed over the substrate, wherein the light-emitting diode comprises:
a first semiconductor structure having an upper surface and a lower surface;
a second semiconductor layer disposed adjacent to the upper surface;
a third semiconductor layer disposed adjacent to the lower surface;
two light-emitting layers disposed between the upper surface and the second semiconductor layer and disposed between the lower surface and the third semiconductor layer, respectively;
a first electrode disposed over the second semiconductor layer; and
a second electrode disposed over the third semiconductor layer;
wherein the first semiconductor structure of the light-emitting diode is electrically connected to one of the thin film transistor and the common electrode, and the second semiconductor layer and the third semiconductor layer are electrically connected to the other one of the thin film transistor and the common electrode.
2. The display device as claimed in claim 1 , further comprising:
a conductive binding layer disposed between the light-emitting diode and the thin film transistor substrate, wherein a material of the conductive binding layer comprises:
solder, indium, anisotropic conductive film, conductive silver glue, or a combination thereof.
3. The display device as claimed in claim 1 , wherein the first semiconductor structure comprises a first semiconductor layer.
4. The display device as claimed in claim 3 , wherein the first semiconductor layer is P-type.
5. The display device as claimed in claim 4 , wherein the second semiconductor layer and the third semiconductor layer are N-type respectively.
6. The display device as claimed in claim 1 , wherein when viewed from a cross-sectional view crossing the upper surface and the lower surface, the second semiconductor layer has an edge adjacent to the upper surface and the edge having a first width, and the second semiconductor layer has another edge adjacent to the first electrode and the another edge having a second width, wherein the first width is greater than the second width.
7. The display device as claimed in claim 1 , wherein the first semiconductor structure comprises:
two first semiconductor layers; and
a conductive adhesive layer disposed between the two first semiconductor layers.
8. The display device as claimed in claim 7 , wherein the first semiconductor structure further comprises:
two third electrodes disposed over the two first semiconductor layers respectively.
9. The display device as claimed in claim 8 , wherein a thickness of each of the third electrodes is greater than a thickness of the first electrode, and the thickness of each of the third electrodes is greater than a thickness of the second electrode.
10. The display device as claimed in claim 8 , wherein the light-emitting diode further comprises a filling layer encapsulating the first semiconductor structure, the second semiconductor layer, the third semiconductor layer and the two third electrodes.
11. The display device as claimed in claim 10 , wherein the two third electrodes are exposed from the filling layer.
12. The display device as claimed in claim 1 , wherein the first semiconductor structure comprises a first semiconductor layer, and the first semiconductor layers are N-type, and the second semiconductor layer and the third semiconductor layer are P-type.
13. The display device as claimed in claim 1 , wherein the first semiconductor structure comprises:
a conductive substrate having two opposite surfaces; and
two first semiconductor layers disposed adjacent to the two opposite surfaces of the conductive substrate respectively.
14. The display device as claimed in claim 13 , wherein the conductive substrate further comprises:
a first sub-substrate;
a second sub-substrate; and
a conductive adhesive layer disposed between the first sub-substrate and the second sub-substrate.
15. The display device as claimed in claim 13 , wherein the first semiconductor structure further comprises:
two third electrodes disposed adjacent to the two opposite surfaces of the conductive substrate respectively.
16. The display device as claimed in claim 15 , wherein a thickness of each of the third electrodes is greater than a thickness of the first electrode, and the thickness of each of the third electrodes is greater than a thickness of the second electrode.
17. The display device as claimed in claim 15 , wherein the light-emitting diode further comprises a filling layer encapsulating the first semiconductor structure, the second semiconductor layer, the third semiconductor layer and the two third electrodes.
18. The display device as claimed in claim 17 , wherein the two third electrodes are exposed from the filling layer.