IP Library Granted Patent US 10,017,673
Granted Patent B2
US 10,017,673 · App. 15/564,890 · Granted Jul 10, 2018

Polymer fine particle-containing curable resin composition having improved bonding strength against impact peeling

Inventors: Toshihiko Okamoto (Hyogo, JP); Shohei Nishimori (Hyogo, JP)
Assignee: Kaneka Corporation
C09J163/00C08G18/58C08G18/80C08G59/62C08L51/04C08L63/00C09J11/08C09J175/08
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,017,673
App. No.
15/564,890
Granted
Jul 10, 2018
Kind
B2
Abstract

The present invention relates to a curable resin composition containing 100 parts by mass of an epoxy resin (A), 1 to 100 parts by mass of polymer fine particles (B), and 1 to 100 parts by mass of a blocked urethane (C), wherein the polymer fine particles have a core-shell structure of a core layer and a shell layer, the core layer contains diene rubber, the shell layer contains at least a hydroxyl group, and the content of the hydroxyl group of the polymer fine particles (B) is 0.01 to 0.8 mmol/g.

Claims (18)

1. A curable resin composition comprising 100 parts by mass of an epoxy resin (A), 1 to 100 parts by mass of polymer fine particles (B), and 1 to 100 parts by mass of a blocked urethane (C), wherein the polymer fine particles have a core-shell structure of a core layer and a shell layer, the core layer comprises diene rubber, the shell layer comprises at least a hydroxyl group, and the content of the hydroxyl group of the polymer fine particles (B) is 0.01 to 0.8 mmol/g.

2. The curable resin composition according to claim 1 , wherein the polymer fine particles (B) have the shell layer graft-polymerized on the core layer, and the shell layer is polymerized with a monomer having a hydroxyl group and at least one monomer selected from the group consisting of an aromatic vinyl monomer, a vinyl cyanide monomer, and a (meth)acrylate monomer.

3. The curable resin composition according to claim 1 , wherein the diene rubber is butadiene rubber and/or butadiene-styrene rubber.

4. The curable resin composition according to claim 1 , wherein the blocked urethane (C) comprises a compound including a urethane prepolymer having a polyalkylene glycol structure capped with a blocking agent.

5. The curable resin composition according to claim 1 , wherein a mass ratio of polymer fine particles (B) to blocked urethane (C) is 0.2 to 5.

6. The curable resin composition according to claim 1 , wherein the epoxy resin (A) comprises a reactive diluent of a polyepoxide, and the amount of the reactive diluent is 0.5 to 20% by mass per 100% by mass of the epoxy resin (A).

7. The curable resin composition according to claim 1 , wherein the content of the hydroxyl group of the polymer fine particles (B) is 0.01 to 0.4 mmol/g.

8. The curable resin composition according to claim 1 , wherein an epoxy curing agent (D) is contained in an amount of 1 to 80 parts by mass per 100 parts by mass of the epoxy resin (A).

9. The curable resin composition according to claim 1 , wherein a curing accelerator (E) is contained in an amount of 0.1 to 10 parts by mass per 100 parts by mass of the epoxy resin (A).

10. The curable resin composition according to claim 1 , wherein the polymer fine particles (B) are dispersed at a state of primary particles in the curable resin composition.

11. The curable resin composition according to claim 1 , wherein dynamic resistance to cleavage is more than 19 kN/m after curing the curable resin composition.

12. A cured product obtained by curing the curable resin composition as defined in claim 1 .

13. A one pack curable resin composition comprising the curable resin composition as defined in claim 1 .

14. A structural adhesive containing the curable resin composition as defined in claim 1 .

15. The curable resin composition according to claim 2 , wherein the diene rubber is butadiene rubber and/or butadiene-styrene rubber.

16. The curable resin composition according to claim 2 , wherein the blocked urethane (C) comprises a compound including a urethane prepolymer having a polyalkylene glycol structure capped with a blocking agent.

17. The curable resin composition according to claim 3 , wherein the blocked urethane (C) comprises a compound including a urethane prepolymer having a polyalkylene glycol structure capped with a blocking agent.

18. The curable resin composition according to claim 4 , wherein the blocked urethane (C) comprises a compound including a urethane prepolymer having a polypropylene glycol structure or a polytetramethylene glycol structure capped with a blocking agent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 12, 2017
From: OKAMOTO, TOSHIHIKO; NISHIMORI, SHOHEI
To: KANEKA CORPORATION
Reel/Frame 043852/0565 →
Priority Claims (1)
JP 2015-080397 · Apr 9, 2015 · national
Continuity (1)
Related Publication 20180094176A1 · Apr 5, 2018