Multi-layer ceramic capacitor and method of producing the same
A multi-layer ceramic capacitor includes a multi-layer unit, a side margin, and a bonding unit. The multi-layer unit includes ceramic layers and internal electrodes. The ceramic layers are made of first ceramics and laminated in a first direction, the first ceramics having a first average crystal grain diameter. The internal electrodes are disposed between the ceramic layers. The side margin is made of second ceramics and covers the multi-layer unit from a second direction orthogonal to the first direction, the second ceramics having a second average crystal grain diameter. The bonding unit is made of third ceramics and disposed between the multi-layer unit and the side margin, the third ceramics having a third average crystal grain diameter that is larger than the first average crystal grain diameter and the second average crystal grain diameter.
1. A multi-layer ceramic capacitor, comprising:
a multi-layer unit including
ceramic layers that are made of first ceramics and laminated in a first direction, the first ceramics having a first average crystal grain diameter, and
internal electrodes disposed between the ceramic layers;
a side margin that is made of second ceramics and covers the multi-layer unit from a second direction orthogonal to the first direction, the second ceramics having a second average crystal grain diameter; and
a bonding unit that is made of third ceramics and disposed between the multi-layer unit and the side margin, the third ceramics having a third average crystal grain diameter that is larger than the first average crystal grain diameter and the second average crystal grain diameter.
2. The multi-layer ceramic capacitor according to claim 1 , wherein
the bonding unit has a thickness of 5 μm or less.
3. The multi-layer ceramic capacitor according to claim 1 , wherein
the first ceramics, the second ceramics, and the third ceramics each include polycrystal of a common composition system.
4. A method of producing a multi-layer ceramic capacitor, the method comprising:
preparing an unsintered multi-layer chip including
ceramic layers that include a main component of first ceramics and are laminated in a first direction, the first ceramics having a first average particle diameter, and
internal electrodes disposed between the ceramic layers;
producing a body by providing a side margin to a side surface of the multi-layer chip via a bonding unit, the side margin including a main component of second ceramics having a second average particle diameter, the side surface being oriented in a second direction orthogonal to the first direction, the bonding unit including a main component of third ceramics having a third average particle diameter that is smaller than the first average particle diameter and the second average particle diameter; and
sintering the body.
5. The method of producing a multi-layer ceramic capacitor according to claim 4 , wherein
the sintering the body includes making an average crystal grain diameter of the bonding unit larger than an average crystal grain diameter of the ceramic layers and the side margin.
6. A multi-layer ceramic capacitor, comprising:
a multi-layer unit including
ceramic layers that are made of first ceramics and laminated in a first direction, the first ceramics having a first average crystal grain diameter, and
internal electrodes disposed between the ceramic layers;
a side margin that is made of second ceramics and covers the multi-layer unit from a second direction orthogonal to the first direction, the second ceramics having a second average crystal grain diameter;
a bonding unit that is made of third ceramics and disposed between the multi-layer unit and the side margin, the third ceramics having a third average crystal grain diameter that is larger than the first average crystal grain diameter and the second average crystal grain diameter; and
a ridge that includes a curved surface over the multi-layer unit, the bonding unit, and the side margin.
7. A method of producing a multi-layer ceramic capacitor, the method comprising:
preparing an unsintered multi-layer chip including
ceramic layers that include a main component of first ceramics and are laminated in a first direction, the first ceramics having a first average particle diameter, and
internal electrodes disposed between the ceramic layers;
producing a body by providing a side margin to a side surface of the multi-layer chip via a bonding unit, the side margin including a main component of second ceramics having a second average particle diameter, the side surface being oriented in a second direction orthogonal to the first direction, the bonding unit including a main component of third ceramics having a third average particle diameter that is smaller than the first average particle diameter and the second average particle diameter;
sintering the body; and
performing barrel polishing on the body one of before the sintering and after the sintering, to form a ridge on the body, the ridge including a curved surface over the multi-layer unit, the bonding unit, and the side margin.