Wafer with gel-based biochips for electrochemical synthesis and electrical detection of polymers
An embodiment of the invention relates to a wafer comprising a plurality of biochips and interconnects on the wafer, the biochip comprising a biochip pad, a synthesis electrode and a gel comprising a probe, wherein a plurality of the biochip pads of the plurality of the biochips are interconnected by the interconnects to carry out a chemical reaction on a plurality of the synthesis electrodes.
1. A wafer comprising a plurality of biochips and interconnects, each of the plurality of biochips comprising a biochip pad, at least two measurement electrodes, a synthesis electrode, a ground electrode, a gap between the at least two measurement electrodes, a porous dielectric isolation layer that electrically isolates the measurement electrodes from the synthesis electrode, and a gel comprising a probe, wherein a plurality of the biochip pads of the plurality of the biochips are interconnected by the interconnects to carry out a chemical reaction on a plurality of the synthesis electrodes, wherein the wafer comprises a via interconnection through the wafer, and the biochip pads of the plurality of biochips are interconnected by the via interconnection.
2. The wafer of claim 1 , wherein the chemical reaction is an electrochemical redox reaction.
3. The wafer of claim 1 , wherein the biochip pads are interconnected to carry out the chemical reaction in parallel on the plurality of the synthesis electrodes.
4. The wafer of claim 1 , wherein the synthesis electrode comprises an electrode to generate a deprotecting reagent, a polymerization electrode to polymerize a polymer thereon, and a confinement electrode adjacent to the polymerization electrode to confine a reductive molecule or an oxidative molecule.
5. The wafer of claim 4 , wherein the reductive molecule comprises a proton, a free radical, or combination thereof.
6. The wafer of claim 4 , wherein the oxidative molecule comprises a hydroxyl ion, a free radical, or combination thereof.
7. The wafer of claim 1 , wherein the wafer comprises a wafer pad, and wherein the biochip pads of the plurality of biochips are interconnected by the via interconnect to the wafer pad.
8. The wafer of claim 1 , wherein the biochip pads of the plurality of biochips are configured to be interconnected to a connection outside the wafer through the via interconnect.
9. The wafer of claim 1 , wherein the biochip pads of the plurality of biochips are configured to be interconnected by a probe card.
10. The wafer of claim 1 , wherein each of the plurality of biochips further comprises a complementary metal oxide semiconductor (CMOS) switch between the biochip pad and the synthesis electrode.
11. The wafer of claim 1 , wherein the gel is in the gap, and the porous dielectric isolation layer is between the synthesis electrode and the gel, wherein the gap is filled with the gel.