IP Library › Granted Patent US 1,003,834
Granted Patent S1
US 1,003,834 · App. 29/820,708 · Granted Nov 7, 2023

Heat insulator cover of semiconductor manufacturing apparatus

Inventor: Yusaku Okajima (Toyama, JP)
Assignee: KOKUSAI ELECTRIC CORPORATION
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Quick Facts
Patent No.
US 1,003,834
App. No.
29/820,708
Granted
Nov 7, 2023
Kind
S1
Claims (1)

The ornamental design for a heat insulator cover of semiconductor manufacturing apparatus, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 23, 2023
From: OKAJIMA, YUSAKU
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 064041/0769 →
Priority Claims (1)
JP 2021-014030 D · Jun 28, 2021 · national