IP Library › Granted Patent US 1,005,245
Granted Patent S1
US 1,005,245 · App. 29/789,775 · Granted Nov 21, 2023

Electrode cover for a plasma processing apparatus

Inventors: Shintarou Nakatani (Tokyo, JP); Takamasa Ichino (Tokyo, JP); Kazunori Nakamoto (Tokyo, JP); Yuki Tanaka (Tokyo, JP)
Assignee: Hitachi High-Tech Corporation
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Quick Facts
Patent No.
US 1,005,245
App. No.
29/789,775
Granted
Nov 21, 2023
Kind
S1
Claims (1)

The ornamental design for an electrode cover for a plasma processing apparatus, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2022
From: NAKATANI, SHINTAROU; ICHINO, TAKAMASA; NAKAMOTO, KAZUNORI; TANAKA, YUKI
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 058907/0204 →
Priority Claims (1)
JP 2021-008306 D · Apr 19, 2021 · national