IP Library › Granted Patent US 1,005,992
Granted Patent S1
US 1,005,992 · App. 29/821,531 · Granted Nov 28, 2023

Headphone

Inventors: Pohsun Lee (Shenzhen, CN); Laurent Lindenberger (Shenzhen, CN)
Assignee: Harman International Industries, Incorporated
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Quick Facts
Patent No.
US 1,005,992
App. No.
29/821,531
Granted
Nov 28, 2023
Kind
S1
Claims (1)

The ornamental design for a headphone, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2022
From: LEE, POHSUN; LINDENBERGER, LAURENT
To: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
Reel/Frame 059102/0179 →