IP Library › Granted Patent US 1,007,490
Granted Patent S1
US 1,007,490 · App. 29/874,498 · Granted Dec 12, 2023

Phone case

Inventor: Kin Wai Hung (Shenzhen, CN)
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Quick Facts
Patent No.
US 1,007,490
App. No.
29/874,498
Granted
Dec 12, 2023
Kind
S1
Claims (1)

The ornamental design for a phone case, as shown and described.

Priority Claims (1)
EM 015018623-0003 · Apr 19, 2023 · regional