IP Library › Granted Patent US 10,075,786
Granted Patent B2
US 10,075,786 · App. 15/413,226 · Granted Sep 11, 2018

Headphone earpiece cover

Inventor: Jared Larsen (Kaysville, UT)
H04R1/1091H04R1/1008H04R1/1058
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Quick Facts
Patent No.
US 10,075,786
App. No.
15/413,226
Granted
Sep 11, 2018
Kind
B2
Abstract

Described herein is a headphone earpiece cover for covering an earpiece of a headphone, the headphone earpiece including a first portion, second portion, and third portion. The headphone earpiece cover includes a first fabric configured to overlay the first portion of the earpiece, a second fabric configured to overlay the second portion of the earpiece, and a third fabric configured to overlay the third portion of the earpiece. The first fabric, second fabric, and third fabric are different from each other.

Claims (37)

1. A headphone earpiece cover for covering an earpiece of a headphone, the headphone earpiece comprising a first portion, second portion, and third portion, the cover comprising:

a first fabric configured to overlay the first portion of the earpiece;

a second fabric configured to overlay the second portion of the earpiece; and

a third fabric configured to overlay the third portion of the earpiece;

wherein the first fabric, second fabric, and third fabric are different from each other; and

wherein the first fabric comprises a friction-inducing element coupled to the second fabric and configured to frictionally engage an outer surface of the earpiece.

2. The cover of claim 1 , wherein the first fabric, second fabric, and third fabric are different materials from each other, and wherein the first fabric comprises a polyester blend.

3. The cover of claim 2 , wherein the second fabric comprises at least one of neoprene, polyurethane, and polyethylene.

4. The cover of claim 3 , wherein the second fabric comprises:

a polyester mesh; and

a lamination disposed on a side of the polyester mesh, wherein the lamination comprises at least one of polyurethane and polyethylene.

5. The cover of claim 3 , wherein the third fabric comprises a mesh.

6. The cover of claim 1 , wherein the first fabric overlays a housing portion of the earpiece of a headphone.

7. The cover of claim 6 , wherein the second fabric overlays a cushion portion of the earpiece.

8. The cover of claim 7 , wherein the third fabric overlays a speaker portion of the earpiece.

9. The cover of claim 1 , wherein the friction-inducing element circumferentially engages the outer surface of the earpiece to seal against the earpiece and prevent contaminants from passing between the headphone earpiece cover and the earpiece.

10. A headphone earpiece cover for covering an earpiece of a headphone, the headphone earpiece comprising a first portion, second portion, and third portion, the cover, comprising:

a first fabric configured to overlay the first portion of the earpiece;

a second fabric configured to overlay the second portion of the earpiece; and

a third fabric configured to overlay the third portion of the earpiece;

wherein, the first fabric, second fabric, and third fabric are different from each other;

wherein the first fabric, second fabric, and third fabric are different materials from each other, and wherein the first fabric comprises a polyester blend;

wherein the second fabric comprises at least one of neoprene, polyurethane, and polyethylene; and

wherein the second fabric comprises:

a polyester mesh; and

a lamination disposed on a side of the polyester mesh, wherein the lamination comprises at least one of polyurethane and polyethylene, and wherein the lamination is disposed on a cushion portion of the earpiece.

11. The headphone system of claim 10 , wherein the third fabric comprises a mesh.

12. The headphone system of claim 10 , wherein the first fabric overlays a housing portion of the earpiece of a headphone, wherein the second fabric overlays a cushion portion of the earpiece, and wherein the third fabric overlays a speaker portion of the earpiece.

13. The headphone system of claim 10 , wherein the first fabric comprises a friction inducing element coupled to the second fabric and configured to frictionally engage an outer surface of the earpiece.

14. The headphone system of claim 10 , wherein a friction inducing element circumferentially engages the outer surface of the earpiece to seal against the earpiece and prevent contaminants from passing between the cover and the earpiece.

15. A method of covering an earpiece of a headphone with a headphone earpiece cover, the method comprising:

providing a headphone earpiece, comprising a first portion, a second portion, and a third portion;

providing a headphone earpiece cover comprising a first fabric, a second fabric, and a third fabric;

overlaying the first fabric over the first portion of the headphone;

overlaying the second fabric over the second portion of the headphone; and

overlaying the third fabric over the third portion of the headphone;

wherein overlaying the first fabric over the first portion of the headphone comprises engaging a friction-inducing element of the headphone earpiece cover with the first portion to seal against the earpiece and prevent contaminants from passing between the headphone earpiece cover and the headphone earpiece.

Continuity (2)
Provisional Application 62281420 · Jan 21, 2016
Related Publication 20170215000A1 · Jul 27, 2017
Cited By (1)
US 1,076,871