IP Library › Granted Patent US 1,008,210
Granted Patent S1
US 1,008,210 · App. 29/803,538 · Granted Dec 19, 2023

Headphone

Inventors: Pohsun Lee (Shenzhen, CN); Laurent Lindenberger (Shenzhen, CN)
Assignee: Harman International Industries, Incorporated
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Quick Facts
Patent No.
US 1,008,210
App. No.
29/803,538
Granted
Dec 19, 2023
Kind
S1
Claims (1)

The ornamental design for a headphone, as shown and described.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 29, 2021
From: LEE, POHSUN; LINDENBERGER, LAURENT
To: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
Reel/Frame 057962/0509 →
Cited By (2)
US 12,480,304 US 12,571,221