Low thermal impedance structure in a phased array
An antenna system including: a metal base plate; an antenna element arranged on and extending away from the front side of the base plate; a circuit board including a ground plane, adjacent to, and in thermal contact with the base plate; a plurality of electrical components on the circuit board including a power amplifier and an I/O connector; a metal support plate separated from, parallel to, and facing the base plate, with the circuit board located between the base and support plates; a plurality of thermally conductive standoffs thermally connecting the base plate to the support plate; and a master board including an I/O connector mating with the I/O connector on the circuit board and electrically connecting the circuit board to the master board, the master board located between the circuit board and the support plate and including signal paths for routing signals to the circuit board.
1. An antenna system comprising:
a plurality of antenna modules;
a thermally conductive support plate; and
a master board on the support plate, said master board including signal paths for routing signals to the plurality of antenna modules and including a plurality of I/O connectors, wherein the plurality of antenna modules are electrically connected to the master board, and wherein each antenna module of the plurality of antenna modules comprises:
a thermally conductive base plate with front and back sides;
a plurality of thermally conductive standoffs;
an antenna element arranged on and extending away from the front side of the base plate;
a circuit board with front and back sides and including a ground plane on the back side of the circuit board, said ground plane of the circuit board next to and in thermal contact with the back side of the base plate;
a plurality of electrical components mounted on the circuit board, said plurality of electrical components including an I/O connector that mates with a corresponding I/O connector of the plurality of I/O connectors on the master board to electrically connect the circuit board to the master board; and
a power amplifier in thermal contact with the base plate, said power amplifier for driving the antenna element with a transmit signal,
wherein the plurality of thermally conductive standoffs of each antenna module of the plurality of antenna modules thermally connect the base plate of that antenna module to the support plate.
2. The antenna system of claim 1 , wherein the power amplifier is mounted directly on the base plate.
3. The antenna system of claim 1 , wherein the power amplifier is mounted on the circuit board.
4. The antenna system of claim 1 , wherein the plurality of antenna modules are identical to each other.
5. The antenna system of claim 1 , wherein each antenna module of the plurality of antenna modules comprises a plurality of antennas.
6. The antenna system of claim 1 , wherein the support plate and the base plates of the plurality of antenna modules are made of metal.
7. The antenna system of claim 1 , wherein the master board has a plurality of holes through which the plurality of standoffs pass to thereby thermally connect the base plates of the plurality of antenna modules to the support plate.
8. The antenna system of claim 1 , wherein the master board includes only passive electrical components.
9. The antenna system of claim 1 , further comprising an RF transparent radome covering and protecting the plurality of antenna modules and the master board.
10. The antenna system of claim 1 , further comprising a heat sink assembly thermally connected to the support plate, said heat sink assembly for dissipating heat generated by the circuit boards within the plurality of antenna modules.
11. The antenna system of claim 10 , wherein the heat sink assembly comprises a plurality of metal fins for convectively dissipating heat.
12. The antenna system of claim 1 , wherein the signal paths on the master board are for routing IF and local oscillator signals to the circuit boards in each antenna module of the plurality of antenna modules.
13. The antenna system of claim 1 , wherein the circuit board in each antenna module of the plurality of antenna modules is a printed wire board.
14. The antenna system of claim 1 , wherein the master board is a printed wire board.
15. An antenna system comprising:
an antenna module comprising:
a thermally conductive base plate with front and back sides;
a plurality of thermally conductive standoffs;
an antenna element arranged on and extending away from the front side of the base plate;
a circuit board with front and back sides and including a ground plane on the back side of the circuit board, said ground plane of the circuit board next to and in thermal contact with the back side of the base plate;
a plurality of electrical components mounted on the circuit board, said plurality of electrical components including an I/O connector; and
a power amplifier in thermal contact with the base plate, said power amplifier for driving the antenna element with a transmit signal,
said antenna system further comprising:
a thermally conductive support plate with front and back sides, the front side of the support plate separated from, parallel to, and facing the front side of the base plate, and wherein the circuit board is located between the base plate and the support plate; and
a master board including an I/O connector mating with the I/O connector on the circuit board and electrically connecting the circuit board to the master board, said master board located between the circuit board and the front side of the support plate, said master board including signal paths for routing signals to the circuit board, and wherein the plurality of thermally conductive standoffs thermally connect the base plate to the support plate.
16. The antenna system of claim 15 , wherein the power amplifier is mounted directly on the base plate.
17. The antenna system of claim 15 , wherein the power amplifier is mounted on the circuit board.
18. The antenna system of claim 15 , wherein the base plate and the support plate are made of metal.
19. The antenna system of claim 15 , further comprising a heat sink assembly thermally connected to the support plate, said heat sink assembly for dissipating heat generated by the circuit board.
20. The antenna system of claim 19 , wherein the heat sink assembly comprises a plurality of metal fins for convectively dissipating heat.
21. The antenna system of claim 15 , wherein the master board has a plurality of holes through which the plurality of standoffs pass to thereby thermally connect the base plate to the support plate.
22. The antenna system of claim 15 , further comprising a heat conducting material sandwiched between the back surface of the circuit board and the back surface of the base plate.
23. The antenna system of claim 22 , wherein the heat conducting material is a thermally conductive gasket.
24. The antenna system of claim 15 , wherein the signal paths on the master board are for routing IF and local oscillator signals to the circuit board.
25. The antenna system of claim 15 , further comprising an RF transparent radome covering and protecting the antenna module and the master board.
26. The antenna system of claim 15 , wherein the master board includes only passive electrical components.
27. The antenna system of claim 15 , wherein the master board is mounted on the support plate.
28. The antenna system of claim 15 , wherein the circuit board is a printed wire board.
29. The antenna system of claim 15 , wherein the master board is a printed wire board.