Integrated circuit device and method for manufacturing same
An integrated circuit device includes an insulating film, a contact extending in a first direction and being provided inside the insulating film, and an insulating member. A composition of the insulating member is different from a composition of the insulating film. A level difference is formed in a side surface of the contact, a portion of a region of the side surface other than the level difference contacts the insulating film. The insulating member contacts the level difference.
1. An integrated circuit device, comprising:
an insulating film;
a contact extending in a first direction and being provided inside the insulating film, the contact including a first portion, a second portion, and a third portion arranged in this order along the first direction, a diameter of the second portion being larger than a diameter of the first portion in a second direction orthogonal to the first direction, the diameter of the second portion being larger than a diameter of the third portion in the second direction, a side surface of the first portion and a side surface of the third portion contacting the insulating film; and
an insulating member contacting a side surface of the second portion, a composition of the insulating member being different from a composition of the insulating film.
2. The device according to claim 1 , wherein a configuration of the insulating member is an annular configuration surrounding the contact.
3. An integrated circuit device, comprising:
a stacked body including a plurality of insulating films and a plurality of electrode films stacked alternately along a first direction;
a semiconductor member extending in the first direction and being provided inside the stacked body, the semiconductor member including a first portion, a second portion, and a third portion arranged in this order along the first direction, the second portion being disposed inside one of the insulating films, a diameter of the second portion being larger than a diameter of the first portion in a second direction orthogonal to the first direction, the diameter of the second portion being larger than a diameter of the third portion in the second direction; and
a charge storage film provided between the semiconductor member and one of the electrode films.
4. The device according to claim 3 , further comprising an insulating member provided on a side surface of the second portion, a composition of the insulating member being different from a composition of the insulating film.
5. The device according to claim 4 , wherein a configuration of the insulating member is an annular configuration surrounding the second portion.
6. The device according to claim 3 , wherein the electrode film most proximal to the second portion of the plurality of electrode films provided around the third portion includes an extension portion extending onto a side surface of the second portion.
7. The device according to claim 6 , wherein a configuration of the extension portion is an annular configuration surrounding the second portion.
8. An integrated circuit device, comprising:
a substrate;
a stacked body provided in a first region on the substrate, the stacked body including a plurality of first insulating films and a plurality of electrode films stacked alternately along a first direction;
a second insulating film provided in a second region on the substrate;
a semiconductor member extending in the first direction and being provided inside the stacked body, the semiconductor member including a first portion, a second portion, and a third portion arranged in this order along the first direction, the second portion being disposed inside one of the first insulating films, a diameter of the second portion being larger than a diameter of the first portion in a second direction orthogonal to the first direction, the diameter of the second portion being larger than a diameter of the third portion;
a charge storage film provided between the semiconductor member and one of the electrode films;
a contact extending in the first direction and being provided inside the second insulating film; and
a first insulating member contacting a side surface of the contact, a composition of the first insulating member being different from a composition of the second insulating film.
9. The device according to claim 8 , wherein
a level difference is formed in the side surface of the contact, a portion of a region of the side surface other than the level difference contacts the second insulating film, and
the first insulating member contacts the level difference.
10. The device according to claim 8 , wherein
a first portion, a second portion, and a third portion of the contact are arranged in this order along the first direction,
a diameter of the second portion is larger than a diameter of the first portion in the second direction, the diameter of the second portion is larger than a diameter of the third portion in the second direction,
a side surface of the first portion and a side surface of the third portion contact the second insulating film, and
the first insulating member contacts a side surface of the second portion.
11. The device according to claim 8 , further comprising a second insulating member provided on a side surface of the second portion of the semiconductor member, a composition of the second insulating member being different from a composition of the first insulating film,
a position of an upper surface of the first insulating member being equal to a position of an upper surface of the second insulating member in the first direction.