IP Library Granted Patent US 1,009,464
Granted Patent S1
US 1,009,464 · App. 29/822,499 · Granted Jan 2, 2024

Card package

Inventors: Xiangyang Zhang (Guangdong, CN); Yi Xiao (Guangdong, CN)
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Quick Facts
Patent No.
US 1,009,464
App. No.
29/822,499
Granted
Jan 2, 2024
Kind
S1
Claims (1)

The ornamental design for a card package, as shown and described.