Heat transfer assembly providing heat transfer from a module mounted on a circuit board through the circuit board
A heat transfer assembly may be used to provide a thermal conduit from a module mounted on a circuit board through the circuit board, allowing a thermal path away from the module. The heat transfer assembly generally includes a thermally conductive base with at least one raised thermal pedestal accessible through at least one heat transfer aperture in the circuit board and in thermal contact with the module. In an embodiment, the heat transfer assembly is used in a remote PHY device (RPD) in an optical node, for example, in a CATV/HFC network. The RPD includes an enclosure having a base with at least one raised thermal pedestal in thermal contact with an optical module (e.g., an optical transmitter or transceiver) on a circuit board through at least one heat transfer aperture in the circuit board.
1. A heat transfer assembly comprising:
a base including at least one raised thermal pedestal, wherein the base is made of metal;
a circuit board including a first side, a second side, and a heat transfer aperture passing through the circuit board from the first side to the second side, wherein the circuit board is mounted over the base with the second side facing the base such that the raised thermal pedestal is accessible through the heat transfer aperture from the first side of the circuit board; and
a module mounted to the first side of the circuit board over the heat transfer aperture and in thermal contact with the raised thermal pedestal providing a thermal conduit away from the module through the heat transfer aperture in the circuit board, wherein:
the raised thermal pedestal includes a thermal pad in contact with the module,
the thermal pad does not extend between any portion of the circuit board and the module,
the base includes at least one additional thermal pedestal, and
the circuit board includes at least one electronic component mounted to the second side of the circuit board and in thermal contact with the at least one additional thermal pedestal.
2. The heat transfer assembly of claim 1 , wherein the raised thermal pedestal extends through the heat transfer aperture.
3. The heat transfer assembly of claim 1 , wherein the raised thermal pedestal extends above the first side of the circuit board.
4. The heat transfer assembly of claim 1 , wherein the raised thermal pedestal extends to about a level of the first side of the circuit board.
5. The heat transfer assembly of claim 1 , wherein the raised thermal pedestal extends below a level of the first side of the circuit board.
6. The heat transfer assembly of claim 1 , wherein the module includes at least one heat generating component proximate a side of the electronic module facing the first side of the circuit board.
7. The heat transfer assembly of claim 1 , wherein the module is an optoelectronic module.
8. The heat transfer assembly of claim 1 , wherein the module is an optical transmitter including at least one laser, and wherein the laser is located proximate a side of the optical transmitter facing the first side of the circuit board.
9. The heat transfer assembly of claim 1 , wherein the base includes a plurality of additional thermal pedestals and wherein the circuit board includes a plurality of electronic components mounted to the second side of the circuit board and in thermal contact with respective ones of the additional thermal pedestals.
10. The heat transfer assembly of claim 1 , wherein at least the base is made of cast aluminum.
11. The heat transfer assembly of claim 1 , further including an enclosure around the circuit board, wherein the enclosure includes the base and a cover over the base.
12. The heat transfer assembly of claim 1 , wherein the raised thermal pedestal extends below a level of the second side of the circuit board.
13. A remote PHY device (RPD) comprising:
an RPD enclosure having a base with at least one raised thermal pedestal,
wherein at least the base is made of metal;
a circuit board including a first side, a second side, and a heat transfer aperture passing through the circuit board from the first side to the second side, wherein the circuit board is mounted over the base with the first side facing the base such that the raised thermal pedestal is accessible through the heat transfer aperture from the first side of the circuit board; and
an optical module mounted to the first side of the circuit board over the heat transfer aperture and in thermal contact with the raised thermal pedestal, the optical module including at least an optical transmitter, wherein:
the raised thermal pedestal includes a thermal pad in contact with the optical module,
the thermal pad does not extend between any portion of the circuit board and the optical module,
the base includes at least one additional thermal pedestal, and
the circuit board includes at least one electronic component mounted to the second side of the circuit board and in thermal contact with the at least one additional thermal pedestal.
14. The RPD of claim 13 , wherein the optical module is an optical transmitter including a laser.
15. The RPD of claim 14 , wherein the laser is located proximate a side of the optical transmitter facing the first side of the circuit board.
16. The RPD of claim 13 , wherein the optical module is a small form-factor pluggable module.
17. The RPD of claim 13 , wherein the optical module is positioned adjacent the RPD enclosure and is configured to receive an optical connector for connecting to an optical fiber.
18. The RPD of claim 13 , wherein the base includes a plurality of additional thermal pedestals, and wherein the circuit board includes a plurality of electronic components mounted to the second side of the circuit board and in thermal contact with respective ones of the additional thermal pedestals.
19. The RPD of claim 13 , wherein the raised thermal pedestal extends to about a level of the first side of the circuit board.
20. An optical node comprising:
a node housing;
a remote PHY device (RPD) located in the node housing, the RPD comprising:
an RPD enclosure having a base with at least one raised thermal pedestal, wherein at least the base is made of metal;
a circuit board including a first side, a second side, and a heat transfer aperture passing through the circuit board from the first side to the second side, wherein the circuit board is mounted over the base with the first side facing the base such that the raised thermal pedestal is accessible through the heat transfer aperture from the first side of the circuit board; and
an optical module mounted to the first side of the circuit board over the heat transfer aperture and in thermal contact with the raised thermal pedestal, the optical module including at least an optical transmitter, wherein:
the raised thermal pedestal includes a thermal pad in contact with the optical module,
the thermal pad does not extend between any portion of the circuit board and the optical module,
the base includes at least one additional thermal pedestal, and
the circuit board includes at least one electronic component mounted to the second side of the circuit board and in thermal contact with the at least one additional thermal pedestal.
21. The optical node of claim 20 , wherein the optical module is an optical transmitter including a laser.
22. The optical node of claim 21 , wherein the laser is located proximate a side of the optical transmitter facing the first side of the circuit board.
23. The optical node of claim 20 , wherein the optical module is a small form-factor pluggable module.