Two-component hot-melt adhesive
A moisture-curing two-component composition consisting of a component A containing at least one polyoxyalkylene, polyolefin and/or polyacrylate prepolymer having at least one hydrolysable silane group and at least one solid inert additive selected from hydrocarbons, polyesters or polyamides, a component B containing at least one crosslinking compound for the prepolymers, and auxiliary substances and additives in one or both components, the component A and the two-component composition each having hot-melt adhesive properties.
1. A moisture-curing two-component composition consisting of:
a component A containing at least one polyoxyalkylene, polyolefin and/or polyacrylate prepolymer having at least one hydrolysable silane group and 0.1 to 20 wt % relative to the weight of the composition of at least one solid inert additive comprising polyamide and optionally another compound selected from the group consisting of hydrocarbons, polyesters or both; and
a component B containing at least one crosslinking compound for the prepolymer, component B having a viscosity of 5,000 to 800,000 mPas at 25° C.; and
optionally auxiliary substances selected from the group consisting of resin, plasticizer, stabilizer, water-dissolving or water-absorbing substance, pigment, filler, thickening agent and combinations thereof;
the two-component composition and component A each having hot-melt adhesive properties wherein the composition is free of metal catalyst and comprises a catalyst consisting of amine compounds and/or silane adhesion promoters with amino groups.
2. The two-component composition according to claim 1 , characterized in that the inert additive has a softening point of 40 to 150° C.
3. The two-component composition according to claim 1 , characterized in that component B contains
0 to 30 wt. % of one or more silane-crosslinkable compounds,
2 to 60 wt. % of water-absorbing substances,
10 to 60 wt. % of auxiliary substances and additives,
0.5 to 15 wt. % of water,
wherein the sum is 100%.
4. An adhesive for bonding glass, metal, ceramic, wood and/or plastic substrates comprising the two-component composition according to claim 1 .
5. The moisture-curing composition of claim 1 wherein the composition is a hot melt adhesive and component B comprises water and a material having solubility or absorption capacity for water, wherein component B having a viscosity of 20,000 to 800,000 mPas at 25° C.
6. The moisture-curing composition of claim 1 wherein the composition is a hot melt adhesive and a weight ratio of component A to component B ranges from 10 parts A to 3 parts B to 10 parts A to 0.1 parts B.
7. The moisture-curing composition of claim 1 wherein the composition is a hot melt adhesive and components A and B are maintained separately and mixed before use while component A is in a molten state.
8. The moisture-curing composition of claim 1 wherein the composition is a hot melt adhesive and components A and B are maintained separately and mixed before use while component A is in a molten state and the mixed adhesive has a melting point above 25° C. and will solidify without crosslinking below 25° C.
9. The two-component composition according to claim 1 , being free of optional auxiliary substances.
10. The two-component composition according to claim 1 , wherein the crosslinking compound in component B contains water and/or silane-crosslinkable compounds.
11. The two-component composition according to claim 1 , wherein the crosslinking compound in component B contains up to 15 wt. % of water and/or up to 30 wt. % of silane-crosslinkable compounds.
12. An adhesive comprising the two-component composition according to claim 1 .
13. Cured reaction products of the two-component composition according to claim 1 .