IP Library Granted Patent US 10,101,229
Granted Patent B2
US 10,101,229 · App. 15/014,166 · Granted Oct 16, 2018

Pressure sensor having a helmholtz resonator

Inventors: Louis DeRosa (Wayne, NJ); Robert Gardner (Westwood, NJ); Joseph VanDeWeert (Maywood, NJ); Adam Hurst (New York, NJ)
Assignee: Kulito Semiconductor Products, Inc.
G01L9/06G01L9/0052G01L9/0054G01L11/04
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Quick Facts
Patent No.
US 10,101,229
App. No.
15/014,166
Granted
Oct 16, 2018
Kind
B2
Abstract

This disclosure provides example methods, devices, and systems for a sensor having a Helmholtz resonator. In one embodiment, a system may comprise a sensing element; a header coupled to the sensing element; a housing coupled to the header; an adaptor coupled to the housing; a screen disposed in an opening of the housing, wherein a first cavity is disposed between the screen and the sensing element and a second cavity is disposed between the adaptor and the sensing element, and the screen in combination with the first cavity and the second cavity form a Helmholtz resonator.

Claims (25)

1. A system, comprising:

a sensing element;

a header coupled to the sensing element;

a housing coupled to the header;

an adaptor coupled to the housing; and

a first gap disposed between the sensing element and the adapter, the first gap adapted to form a first cavity around at least a portion of the sensing element such that the sensing element is at least partially isolated from a stress applied at the adapter.

2. The system of claim 1 , wherein the first cavity is configured to reduce Helmholtz-related resonance.

3. The system of claim 1 , wherein the adaptor comprises a front surface adapted to form a front seal between the sensing element and a mating surface.

4. The system of claim 1 , further comprising a second gap disposed between the header and the adapter, the second gap adapted to form a second cavity around at least a portion of the header.

5. The system of claim 4 , wherein the second cavity is adapted such that the header is at least partially isolated from a stress applied at the adaptor.

6. The system of claim 4 , wherein the second gap is less than about 0.040 inches.

7. The system of claim 4 , wherein the second gap is in the range of between about 0.005 inches to about 0.040 inches.

8. The system of claim 1 , further comprising a screen disposed in an opening of the housing, wherein a third cavity is disposed between the screen and the sensing element.

9. The system of claim 8 , wherein the screen in combination with the first cavity and the second cavity form a Helmholtz resonator.

10. The system of claim 1 , wherein the first gap is less than about 0.015 inches.

11. The system of claim 1 , wherein the first gap is in the range of between about 0.001 inches to about 0.015 inches.

12. The system of claim 1 , wherein the sensing element is a piezoresistive leadless sensor.

13. The system of claim 1 , wherein the sensing element is used to measure a pressure.

14. The system of claim 1 , wherein the adapter is disposed around and defines an opening and the sensing element is disposed in the opening.

15. The system of claim 14 , wherein a size and a shape of the opening is about equivalent to a corresponding size and a corresponding shape of the sensing element.

16. The system of claim 1 , wherein the first gap is configured to allow a fluid to be disposed between the adaptor and the sensing element.

17. The system of claim 16 , wherein the adapter is disposed around and defines an opening and the sensing element is disposed in the opening, and wherein a size and a shape of the opening is about equivalent to a corresponding size and a corresponding shape of the sensing element to reduce fluid impact on the sensing element.

18. The system of claim 15 , wherein the shape of the opening is square.

19. The system of claim 1 , wherein a response time of the sensing element is less than about fifty microseconds.

20. The system of claim 1 , wherein a stress applied at a front surface of the adapter is transferred to the housing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2016
From: DEROSA, LOUIS; GARDNER, ROBERT; VANDEWEERT, JOSEPH R.; HURST, ADAM
To: KULITE SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 037655/0376 →
Continuity (2)
Continuation 14187372 · Feb 24, 2014
Related Publication 20160153859A1 · Jun 2, 2016