IP Library Granted Patent US 10,106,421
Granted Patent B2
US 10,106,421 · App. 15/380,460 · Granted Oct 23, 2018

Composition and method for depolymerization of cured epoxy resin materials using transition metal salts

Inventors: Munju Goh (Wanju-gun, KR); Nam Ho You (Wanju-gun, KR); Hyeonuk Yeo (Wanju-gun, KR); Bon-Cheol Ku (Wanju-gun, KR); Sang Jun Youn (Wanju-gun, KR); Jin Won Yu (Wanju-gun, KR); Jin Jung (Wanju-gun, KR)
Assignee: Korea Institute of Science and Technology
C01B31/0492B01J23/22B01J23/26B01J23/34B01J23/36B01J23/466B01J27/13C01B32/17C01B32/196C01B32/23C01B32/956C01F7/021C08J11/16C08J2300/24C08J2363/00
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Quick Facts
Patent No.
US 10,106,421
App. No.
15/380,460
Granted
Oct 23, 2018
Kind
B2
Abstract

For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.

Claims (11)

1. A method for depolymerization of a cured epoxy resin material, comprising:

introducing a cured epoxy resin material to a composition for depolymerization comprising a transition metal salt or a transition metal oxide containing a transition metal element in an aqueous solvent in a liquid state, having a dielectric constant of 65 to 80, wherein the depolymerization is carried out at a temperature of 20° C. to 200° C.

2. The method for depolymerization of a cured epoxy resin material according to claim 1 , wherein the temperature is 20° C. to 100° C.

3. The method for depolymerization of a cured epoxy resin material according to claim 1 , wherein the amount of cured epoxy resin material is 1-90 parts by weight based on 100 parts by weight of the composition for depolymerization.

4. The method for depolymerization of a cured epoxy resin material according to claim 1 , further comprising introducing a new cured epoxy resin material to the composition for depolymerization remaining after depolymerizing the cured epoxy resin material.

5. The method for depolymerization of a cured epoxy resin material according to claim 1 , further comprising pretreating the cured epoxy resin material before introducing the cured epoxy resin material to the composition for depolymerization such that the cured epoxy resin material has an increased reaction surface area.

6. The method for depolymerization of a cured epoxy resin material according to claim 5 , wherein the pretreatment is physical pretreatment, chemical pretreatment or a combination thereof.

7. The method for depolymerization of a cured epoxy resin material according to claim 6 , wherein the physical pretreatment is at least one selected from dry crushing and wet crushing.

8. The method for depolymerization of a cured epoxy resin material according to claim 6 , wherein the chemical pretreatment is carried out by dipping the cured epoxy resin material into an acidic composition having a pH less than 7.

9. The method for depolymerization of a cured epoxy resin material according to claim 1 , wherein a filler obtained after the depolymerization has a transition metal remaining therein.

10. The method of claim 1 , wherein the aqueous solvent is water alone.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2016
From: GOH, MUNJU; YOU, NAM HO; YEO, HYEONUK; KU, BON-CHEOL; YOUN, SANG JUN; YU, JIN WON; JUNG, JIN
To: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
Reel/Frame 040970/0154 →
Priority Claims (1)
KR 10-2015-0180187 · Dec 16, 2015 · national
Continuity (1)
Related Publication 20170174523A1 · Jun 22, 2017