Package method of substrate and package sturcture
A package structure includes a substrate and a package plate. A frame is formed of a seal glue arranged between the substrate and the package plate. An underfill is positioned inboard of the frame. The package plate has a spreading surface, and at least one groove is formed in a spreading path of the frame on the spreading surface of the package plate.
1. A package structure, comprising:
a substrate;
a package plate, which has a spreading surface that is set opposite to and spaced from the substrate; and
a bonding frame of seal glue, which is arranged between the substrate and the surface of the package plate, wherein the bonding frame comprises an inner glue frame and an outer glue frame that are spaced from each other;
wherein the package plate comprises a first groove formed in a first spreading path corresponding to the inner glue frame and a second groove formed in a second spreading path corresponding to the outer glue frame, wherein the first groove in the first spreading path is substantially in alignment with the second groove in the second spreading path in a lateral or a longitudinal direction as seen in a plan view of the spreading surface.
2. The package structure according to claim 1 further comprising an underfill positioned inboard of the inner glue frame.
3. The package structure according to claim 2 , wherein the underfill comprises a liquid transparent drier.
4. The package structure according to claim 1 , wherein the substrate is a thin-film transistor (TFT) substrate having organic light emitting diode (OLED) elements.
5. The package structure according to claim 1 , wherein the seal glue is UV glue.
6. The package structure according to claim 1 , wherein a width of the inner glue frame in the first groove is larger than 2 mm.
7. The package structure according to claim 1 , wherein a width of the outer glue frame in the second groove is larger than 2 mm.
8. A package structure, comprising:
a substrate;
a package plate, which has a spreading surface that is set opposite to and spaced from the substrate; and
a bonding frame of seal glue, which is arranged between the substrate and the surface of the package plate, wherein the bonding frame comprises an inner glue frame and an outer glue frame that are spaced from each other;
wherein the package plate comprises a first groove formed in a first spreading path corresponding to the inner glue frame and a second groove formed in a second spreading path corresponding to the outer glue frame, wherein the first groove in the first spreading path is substantially in alignment with the second groove in the second spreading path in a lateral or a longitudinal direction as seen in a plan view of the spreading surface, a width of each of the inner glue frame and the outer glue frame respectively in the first groove and the second groove being larger than 2 mm.
9. The package structure according to claim 8 further comprising an underfill positioned inboard of the inner glue frame.
10. The package structure according to claim 8 , wherein the substrate is a thin-film transistor (TFT) substrate having organic light emitting diode (OLED) elements.
11. The package structure according to claim 8 , wherein the seal glue is UV glue.
12. The package structure according to claim 9 , wherein the underfill comprises a liquid transparent drier.